Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8704378 | Semiconductor device | Mitsuo Sugino, Hiroyuki Yamashita | 2014-04-22 |
| 8652941 | Wafer dicing employing edge region underfill removal | Richard F. Indyk, Jae-Woong Nah, Daisuke Oka, Shigefumi Okada | 2014-02-18 |
| 8629564 | Semiconductor electronic component and semiconductor device using the same | Tomoe Yamashiro, Takashi Hirano | 2014-01-14 |
| 8597785 | Adhesive film | Toshio Komiyatani, Takashi Hirano, Kenzou Maejima, Tomoe Yamashiro | 2013-12-03 |
| 8531028 | Method for manufacturing electronic component, and electronic component | Kenzou Maejima, Toru Meura | 2013-09-10 |
| 8319350 | Adhesive tape and semiconductor device using the same | Tomoe Yamashiro, Takashi Hirano | 2012-11-27 |
| 8169090 | Encapsulating resin composition for preapplication, semiconductor device made with the same, and process for producing the same | Yushi Sakamoto, Masaya Koda | 2012-05-01 |
| 8039305 | Method for bonding semiconductor wafers and method for manufacturing semiconductor device | Kenzou Mejima, Mitsuo Sugino | 2011-10-18 |
| 8008122 | Pressurized underfill cure | Michael A. Gaynes, Jae-Woong Nah | 2011-08-30 |
| 7838984 | Adhesive tape, connected structure and semiconductor package | Tomoe Yamashiro, Tetsuya Miyamoto | 2010-11-23 |
| 7829992 | Semiconductor device and method for manufacturing semiconductor device | Mitsuo Sugino, Tomoe Yamashiro, Tetsuya Miyamoto, Hiroyuki Yamashita | 2010-11-09 |