Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11456260 | Wafer processing method | Shunsuke Teranishi, Shuichiro Tsukiji, Yuki IKKU | 2022-09-27 |
| 10211175 | Stress-resilient chip structure and dicing process | Richard F. Indyk, Ian D. Melville | 2019-02-19 |
| 9390958 | Transfer unit including suction openings configured to receive suction pads or seal members therein | Kenta Onishi, Kimitake Mantoku, Hiroyuki Urabe, Yuki Watanabe | 2016-07-12 |
| 9034735 | Laser processing method for workpiece | Nobumori Ogoshi | 2015-05-19 |
| 8652941 | Wafer dicing employing edge region underfill removal | Richard F. Indyk, Jae-Woong Nah, Satoru Katsurayama, Daisuke Oka | 2014-02-18 |