Issued Patents All Time
Showing 1–25 of 30 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11521952 | Spacer for die-to-die communication in an integrated circuit and method for fabricating the same | Charles L. Arvin, Bhupender Singh, Steve Ostrander, Thomas Weiss, Mark W. Kapfhammer | 2022-12-06 |
| 11410894 | Polygon integrated circuit (IC) packaging | Charles L. Arvin, Bhupender Singh, Jon A. Casey, Shidong Li | 2022-08-09 |
| 11031343 | Fins for enhanced die communication | Charles L. Arvin, Bhupender Singh, Jon A. Casey | 2021-06-08 |
| 11031373 | Spacer for die-to-die communication in an integrated circuit | Charles L. Arvin, Bhupender Singh, Steve Ostrander, Thomas Weiss, Mark W. Kapfhammer | 2021-06-08 |
| 10211175 | Stress-resilient chip structure and dicing process | Ian D. Melville, Shigefumi Okada | 2019-02-19 |
| 10134577 | Edge trim processes and resultant structures | Deepika Priyadarshini, Spyridon Skordas, Edmund J. Sprogis, Anthony K. Stamper, Kevin R. Winstel | 2018-11-20 |
| 10090255 | Dicing channels for glass interposers | Brittany L. Hedrick, Vijay Sukumaran, Christopher L. Tessler, Sarah H. Knickerbocker | 2018-10-02 |
| 10002835 | Structure for establishing interconnects in packages using thin interposers | Benjamin V. Fasano, Michael S. Cranmer, Harry D. Cox, Katsuyuki Sakuma, Eric D. Perfecto | 2018-06-19 |
| 9607973 | Method for establishing interconnects in packages using thin interposers | Benjamin V. Fasano, Michael S. Cranmer, Harry D. Cox, Katsuyuki Sakuma, Eric D. Perfecto | 2017-03-28 |
| 8652941 | Wafer dicing employing edge region underfill removal | Jae-Woong Nah, Satoru Katsurayama, Daisuke Oka, Shigefumi Okada | 2014-02-18 |
| 7897059 | High tin solder etching solution | Krystyna W. Semkow | 2011-03-01 |
| 7724527 | Method and structure to improve thermal dissipation from semiconductor devices | Patrick A. Coico, David L. Edwards, David C. Long | 2010-05-25 |
| 7468886 | Method and structure to improve thermal dissipation from semiconductor devices | Patrick A. Coico, David L. Edwards, David C. Long | 2008-12-23 |
| 7294909 | Electronic package repair process | Jon A. Casey, James G. Balz, Michael Berger, Jerome D. Cohen, Charles J. Hendricks +13 more | 2007-11-13 |
| 7087513 | Method to produce low strength temporary solder joints | Benjamin V. Fasano, Kevin M. Prettyman | 2006-08-08 |
| 6955543 | Method and apparatus to form a reworkable seal on an electronic module | Gaetano P. Messina, Patrick A. Coico, Lewis S. Goldmann, Vladimir Jambrih, Jeffrey A. Zitz | 2005-10-18 |
| 6916670 | Electronic package repair process | Jon A. Casey, James G. Balz, Michael Berger, Jerome D. Cohen, Charles J. Hendricks +13 more | 2005-07-12 |
| 6835260 | Method to produce pedestal features in constrained sintered substrates | Benjamin V. Fasano, David H. Gabriels, Glenn A. Pomerantz, Richard A. Shelleman | 2004-12-28 |
| 6823585 | Method of selective plating on a substrate | Mark J. LaPlante, Jon A. Casey, Thomas A. Wassick, David C. Long, Krystyna W. Semkow +8 more | 2004-11-30 |
| 6597058 | Method of forming defect-free ceramic structures using thermally depolymerizable surface layer | Govindarajan Natarajan, Vincent P. Peterson, Krishna G. Sachdev | 2003-07-22 |
| 6376054 | Surface metallization structure for multiple chip test and burn-in | Scott I. Langenthal, Thomas E. Lombardi, John U. Knickerbocker, Srinivasa S. N. Reddy, Richard A. Shelleman +2 more | 2002-04-23 |
| 6312791 | Multilayer ceramic substrate with anchored pad | Benjamin V. Fasano, David H. Gabriels, Sundar M. Kamath, Scott I. Langenthal, Srinivasa S. N. Reddy +1 more | 2001-11-06 |
| 6261927 | Method of forming defect-free ceramic structures using thermally depolymerizable surface layer | Govindarajan Natarajan, Vincent P. Peterson, Krishna G. Sachdev | 2001-07-17 |
| 6258191 | Method and materials for increasing the strength of crystalline ceramic | Benjamin V. Fasano, Lewis S. Goldmann, Sundar M. Kamath, Scott I. Langenthal, Srinivasa S. N. Reddy | 2001-07-10 |
| 6187418 | Multilayer ceramic substrate with anchored pad | Benjamin V. Fasano, David H. Gabriels, Sundar M. Kamath, Scott I. Langenthal, Srinivasa S. N. Reddy +1 more | 2001-02-13 |