Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10672718 | Through-package-via (TPV) structures on inorganic interposer and methods for fabricating same | Venkatesh Sundaram, Fuhan Liu, Rao R. Tummala, Vivek Swaminathan Sridharan, Qiao Chen | 2020-06-02 |
| 10325808 | Crack prevent and stop for thin glass substrates | Ivan Huang, Elavarasan Pannerselvam | 2019-06-18 |
| 10090255 | Dicing channels for glass interposers | Brittany L. Hedrick, Christopher L. Tessler, Richard F. Indyk, Sarah H. Knickerbocker | 2018-10-02 |
| 9892971 | Crack prevent and stop for thin glass substrates | Ivan Huang, Elavarasan Pannerselvam | 2018-02-13 |
| 9805977 | Integrated circuit structure having through-silicon via and method of forming same | Thuy L. Tran-Quinn, Jorge A. Lubguban, John J. Garant | 2017-10-31 |
| 9275934 | Through-package-via (TPV) structures on inorganic interposer and methods for fabricating same | Venkatesh Sundaram, Fuhan Liu, Rao R. Tummala, Vivek Swaminathan Sridharan, Qiao Chen | 2016-03-01 |