Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10672718 | Through-package-via (TPV) structures on inorganic interposer and methods for fabricating same | Venkatesh Sundaram, Rao R. Tummala, Vijay Sukumaran, Vivek Swaminathan Sridharan, Qiao Chen | 2020-06-02 |
| 9275934 | Through-package-via (TPV) structures on inorganic interposer and methods for fabricating same | Venkatesh Sundaram, Rao R. Tummala, Vijay Sukumaran, Vivek Swaminathan Sridharan, Qiao Chen | 2016-03-01 |
| 8536695 | Chip-last embedded interconnect structures | Nitesh Kumbhat, Venkatesh Sundaram, Rao R. Tummala | 2013-09-17 |
| 8391017 | Thin-film capacitor structures embedded in semiconductor packages and methods of making | David Ross McGregor, Cheong-Wo Hunter Chan, Lynne E. Dellis, Deepukumar M. Nair, Venkatesh Sundaram | 2013-03-05 |