Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10827617 | Printed circuit board with cavity | Dingyou Zhang, Li Sun, Sarah Haney, Chang Kyu Choi | 2020-11-03 |
| 10163808 | Module with embedded side shield structures and method of fabricating the same | Deog Soon Choi, Wei-Shun Wang | 2018-12-25 |
| 10134682 | Circuit package with segmented external shield to provide internal shielding between electronic components | Deog Soon Choi, Ashish Alawani, Li Sun | 2018-11-20 |
| 10021790 | Module with internal wire fence shielding | Jin Jeong, Chris Y. Chung, Ashish Alawani | 2018-07-10 |
| 9974181 | Module with external shield and back-spill barrier for protecting contact pads | Sarah Haney, Deog Soon Choi, Hyun Mo Ku, Lea-Teng Lee, Ah Ron Lee | 2018-05-15 |
| 9907169 | Printed circuit board (PCB) and PCB assembly having an encapsulating mold material on a bottom surface thereof and methods for molding an encapsulating mold material on a bottom surface of a PCB | Li Sun, Aaron Lee, Deog Soon Choi, Hyun Mo Ku, Jack Ajoian | 2018-02-27 |
| 9173282 | Interconnect structures and methods of making the same | Pulugurtha Markondeya Raj, Venkatesh Sundaram, Rao R. Tummala | 2015-10-27 |
| 8970036 | Stress relieving second level interconnect structures and methods of making the same | Pulugurtha Markondeya Raj, Venkatesh Sundaram, Rao R. Tummala, Xian Qin | 2015-03-03 |
| 8633601 | Interconnect assemblies and methods of making and using same | Abhishek Choudhury, Venkatesh Sundaram, Rao R. Tummala | 2014-01-21 |
| 8536695 | Chip-last embedded interconnect structures | Fuhan Liu, Venkatesh Sundaram, Rao R. Tummala | 2013-09-17 |