Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9173282 | Interconnect structures and methods of making the same | Nitesh Kumbhat, Venkatesh Sundaram, Rao R. Tummala | 2015-10-27 |
| 8970036 | Stress relieving second level interconnect structures and methods of making the same | Nitesh Kumbhat, Venkatesh Sundaram, Rao R. Tummala, Xian Qin | 2015-03-03 |
| 7556189 | Lead-free bonding systems | Ankur Aggarwal, Isaac Abothu, Rao R. Tummala | 2009-07-07 |
| 7557448 | High-aspect-ratio metal-polymer composite structures for nano interconnects | Ankur Aggarwal, Rao R. Tummala | 2009-07-07 |
| 7262075 | High-aspect-ratio metal-polymer composite structures for nano interconnects | Ankur Aggarwal, Rao R. Tummala | 2007-08-28 |