Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12315787 | Embedded semiconductor packages and methods thereof | Nobuo Ogura, Siddharth Ravichandran, Rao R. Tummala | 2025-05-27 |
| 12027453 | Embedded semiconductor packages and methods thereof | Nobuo Ogura, Siddharth Ravichandran, Rao R. Tummala | 2024-07-02 |
| 10672718 | Through-package-via (TPV) structures on inorganic interposer and methods for fabricating same | Fuhan Liu, Rao R. Tummala, Vijay Sukumaran, Vivek Swaminathan Sridharan, Qiao Chen | 2020-06-02 |
| 10615057 | Encapsulation process for semiconductor devices | Leonard George Chorosinski, Parrish E. Ralston | 2020-04-07 |
| 9417415 | Interposer with polymer-filled or polymer-lined optical through-vias in thin glass substrate | Rao R. Tummala, Chia-Te Chou | 2016-08-16 |
| 9275934 | Through-package-via (TPV) structures on inorganic interposer and methods for fabricating same | Fuhan Liu, Rao R. Tummala, Vijay Sukumaran, Vivek Swaminathan Sridharan, Qiao Chen | 2016-03-01 |
| 9173282 | Interconnect structures and methods of making the same | Pulugurtha Markondeya Raj, Nitesh Kumbhat, Rao R. Tummala | 2015-10-27 |
| 9167694 | Ultra-thin interposer assemblies with through vias | Rao R. Tummala | 2015-10-20 |
| 8970036 | Stress relieving second level interconnect structures and methods of making the same | Pulugurtha Markondeya Raj, Nitesh Kumbhat, Rao R. Tummala, Xian Qin | 2015-03-03 |
| 8633601 | Interconnect assemblies and methods of making and using same | Nitesh Kumbhat, Abhishek Choudhury, Rao R. Tummala | 2014-01-21 |
| 8536695 | Chip-last embedded interconnect structures | Fuhan Liu, Nitesh Kumbhat, Rao R. Tummala | 2013-09-17 |
| 8391017 | Thin-film capacitor structures embedded in semiconductor packages and methods of making | David Ross McGregor, Cheong-Wo Hunter Chan, Lynne E. Dellis, Fuhan Liu, Deepukumar M. Nair | 2013-03-05 |
| 8345433 | Heterogeneous organic laminate stack ups for high frequency applications | George E. White, Sidharth Dalmia, Madhavan Swaminathan | 2013-01-01 |
| 8013688 | Liquid crystalline polymer and multilayer polymer-based passive signal processing components for RF/wireless multi-band applications | George E. White, Madhavan Swaminathan, Sidharth Dalmia | 2011-09-06 |
| 7805834 | Method for fabricating three-dimensional all organic interconnect structures | George E. White, Madhavan Swaminathan, Sidharth Dalmia | 2010-10-05 |
| 7795995 | Liquid crystalline polymer and multilayer polymer-based passive signal processing components for RF/wireless multi-band applications | George E. White, Madhavan Swaminathan, Sidharth Dalmia | 2010-09-14 |
| 7260890 | Methods for fabricating three-dimensional all organic interconnect structures | George E. White, Madhavan Swaminathan, Sidharth Dalmia | 2007-08-28 |
| 7068124 | Integrated passive devices fabricated utilizing multi-layer, organic laminates | George E. White, Madhavan Swaminathan, Sidharth Dalmia | 2006-06-27 |
| 6987307 | Stand-alone organic-based passive devices | George E. White, Madhavan Swaminathan, Sidharth Dalmia | 2006-01-17 |
| 6900708 | Integrated passive devices fabricated utilizing multi-layer, organic laminates | George E. White, Madhavan Swaminathan, Sidharth Dalmia | 2005-05-31 |