Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12255115 | Electronic devices in semiconductor package cavities | Christopher Daniel Manack, Patrick Francis Thompson | 2025-03-18 |
| 12009319 | Integrated circuit with metal stop ring outside the scribe seal | Christopher Daniel Manack, Michael Todd Wyant, Matthew John Sherbin, Patrick Francis Thompson | 2024-06-11 |
| 11942386 | Electronic devices in semiconductor package cavities | Christopher Daniel Manack, Patrick Francis Thompson | 2024-03-26 |
| 11855024 | Wafer chip scale packages with visible solder fillets | Vivek Swaminathan Sridharan, Christopher Daniel Manack, Patrick Francis Thompson, Jonathan Andrew Montoya, Salvatore Frank Pavone | 2023-12-26 |
| 11094611 | Liquid cooled heat dissipation device | Zhen Zhong, Meng Fu | 2021-08-17 |
| 10672718 | Through-package-via (TPV) structures on inorganic interposer and methods for fabricating same | Venkatesh Sundaram, Fuhan Liu, Rao R. Tummala, Vijay Sukumaran, Vivek Swaminathan Sridharan | 2020-06-02 |
| 10477731 | Liquid-cooled radiator | Meng Fu, Lin Liu | 2019-11-12 |
| 10108237 | Heat dissipating device with improved cooling performance | Meng Fu, Wu Xu | 2018-10-23 |
| 9275934 | Through-package-via (TPV) structures on inorganic interposer and methods for fabricating same | Venkatesh Sundaram, Fuhan Liu, Rao R. Tummala, Vijay Sukumaran, Vivek Swaminathan Sridharan | 2016-03-01 |
| 9138840 | Method for manufacturing a heat sink | Meng Fu, ZI-FU YANG, Chun-Chi Chen | 2015-09-22 |
| 7277281 | Heat dissipation device having wire fixture | Cui-Jun Lu, Jin Feng | 2007-10-02 |