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Laser dicing for singulation |
Michael Todd Wyant, Dave Charles Stepniak, Sada Hiroyuki, Shoichi Iriguchi, Genki Yano |
2025-01-14 |
| 12087859 |
Method for improving transistor performance |
Steven Kummerl, Saumya Gandhi |
2024-09-10 |
| 12009319 |
Integrated circuit with metal stop ring outside the scribe seal |
Christopher Daniel Manack, Qiao Chen, Michael Todd Wyant, Patrick Francis Thompson |
2024-06-11 |
| 11837518 |
Coated semiconductor dies |
Michael Todd Wyant, Christopher Daniel Manack, Patrick Francis Thompson, You Chye How |
2023-12-05 |
| 11664276 |
Front side laser-based wafer dicing |
Michael Todd Wyant, Christopher Daniel Manack, Hiroyuki Sada, Shoichi Iriguchi, Genki Yano +2 more |
2023-05-30 |
| 11482442 |
Subring for semiconductor dies |
Michael Todd Wyant, Dave Charles Stepniak, Sada Hiroyuki, Shoichi Iriguchi, Genki Yano |
2022-10-25 |
| 11469141 |
Laser dicing for singulation |
Michael Todd Wyant, Dave Charles Stepniak, Sada Hiroyuki, Shoichi Iriguchi, Genki Yano |
2022-10-11 |
| 11171031 |
Die matrix expander with partitioned subring |
Michael Todd Wyant, Dave Charles Stepniak, Hiroyuki Sada, Shoichi Iriguchi, Genki Yano |
2021-11-09 |
| 10431684 |
Method for improving transistor performance |
Steven Kummerl, Saumya Gandhi |
2019-10-01 |