| 11735435 |
Quad flat no lead package and method of making |
Dan Okamoto |
2023-08-22 |
| 11664276 |
Front side laser-based wafer dicing |
Matthew John Sherbin, Michael Todd Wyant, Christopher Daniel Manack, Shoichi Iriguchi, Genki Yano +2 more |
2023-05-30 |
| 11367699 |
Integrated circuit backside metallization |
Shoichi Iriguchi, Genki Yano, Luu Thanh Nguyen, Ashok S. Prabhu, Anindya Poddar +2 more |
2022-06-21 |
| 11171031 |
Die matrix expander with partitioned subring |
Matthew John Sherbin, Michael Todd Wyant, Dave Charles Stepniak, Shoichi Iriguchi, Genki Yano |
2021-11-09 |
| 10763230 |
Integrated circuit backside metallization |
Shoichi Iriguchi, Genki Yano, Luu Thanh Nguyen, Ashok S. Prabhu, Anindya Poddar +2 more |
2020-09-01 |
| 10665475 |
Quad flat no lead package and method of making |
Dan Okamoto |
2020-05-26 |
| 10658240 |
Semiconductor die singulation |
Shoichi Iriguchi, Genki Yano |
2020-05-19 |
| 9868502 |
Stern tube sealing device |
Kenichi Saito |
2018-01-16 |
| 6330500 |
Actuation controller for air bag device |
Hiroshi Moriyama, Mitsuru Ono |
2001-12-11 |
| 5900807 |
Collision detection device |
Hiroshi Moriyama |
1999-05-04 |
| 5777225 |
Crash sensor |
Hiroshi Moriyama |
1998-07-07 |
| 5396424 |
Crash sensor |
Hiroshi Moriyama, Takeo Shiozawa |
1995-03-07 |
| 5326945 |
Shock sensor |
Noriyuki Gotoh, Yasunori Ohtuki, Naoharu Yamamoto, Akihiko Kuroiwa, Hiroshi Moriyama |
1994-07-05 |
| 5189311 |
Crash sensor |
Hiroshi Moriyama, Takeo Shiozawa |
1993-02-23 |