Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11735435 | Quad flat no lead package and method of making | Hiroyuki Sada | 2023-08-22 |
| 10665475 | Quad flat no lead package and method of making | Hiroyuki Sada | 2020-05-26 |
| 9536753 | Circuit substrate interconnect | Yohei Koto, Kazunori Hayata | 2017-01-03 |
| 9379087 | Method of making a QFN package | — | 2016-06-28 |
| 8465619 | Semiconductor die collet | Seiichi Yamasaki | 2013-06-18 |
| 7790507 | Semiconductor die collet and method | Seiichi Yamasaki | 2010-09-07 |