| 12394671 |
Efficient removal of street test devices during wafer dicing |
Joseph Liu, Christopher Daniel Manack |
2025-08-19 |
| 12198982 |
Laser dicing for singulation |
Dave Charles Stepniak, Matthew John Sherbin, Sada Hiroyuki, Shoichi Iriguchi, Genki Yano |
2025-01-14 |
| 12009319 |
Integrated circuit with metal stop ring outside the scribe seal |
Christopher Daniel Manack, Qiao Chen, Matthew John Sherbin, Patrick Francis Thompson |
2024-06-11 |
| 11837518 |
Coated semiconductor dies |
Matthew John Sherbin, Christopher Daniel Manack, Patrick Francis Thompson, You Chye How |
2023-12-05 |
| 11676829 |
Hyperbaric saw for sawing packaged devices |
Byron Harry Gibbs |
2023-06-13 |
| 11664276 |
Front side laser-based wafer dicing |
Matthew John Sherbin, Christopher Daniel Manack, Hiroyuki Sada, Shoichi Iriguchi, Genki Yano +2 more |
2023-05-30 |
| 11482442 |
Subring for semiconductor dies |
Matthew John Sherbin, Dave Charles Stepniak, Sada Hiroyuki, Shoichi Iriguchi, Genki Yano |
2022-10-25 |
| 11469141 |
Laser dicing for singulation |
Dave Charles Stepniak, Matthew John Sherbin, Sada Hiroyuki, Shoichi Iriguchi, Genki Yano |
2022-10-11 |
| 11171031 |
Die matrix expander with partitioned subring |
Matthew John Sherbin, Dave Charles Stepniak, Hiroyuki Sada, Shoichi Iriguchi, Genki Yano |
2021-11-09 |
| 10840211 |
Semiconductor package with leadframe having pre-singulated leads or lead terminals |
Bradley Glasscock, Christopher Daniel Manack |
2020-11-17 |
| 8883567 |
Process of making a stacked semiconductor package having a clip |
Patricia Sabran Conde, Vikas Gupta, Rajiv Dunne, Emerson Mamaril Enipin |
2014-11-11 |