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Vapor delivery head for preventing stiction of high aspect ratio structures and/or repairing high aspect ratio structures |
Bhaskar BANDARAPU, David Mui, Karl-Heinz Hohenwarter, Nathan Lavdovsky, Christian Putzi +4 more |
2025-01-14 |
| 10861719 |
Method and apparatus for processing wafer-shaped articles |
David Mui, Alois Goller, Michael Ravkin |
2020-12-08 |
| 10720343 |
Method and apparatus for processing wafer-shaped articles |
David Mui, Alois Goller, Mike Ravkin |
2020-07-21 |
| 10312117 |
Apparatus and radiant heating plate for processing wafer-shaped articles |
Hongbo Si, Bridget Hill, Daniel Brien |
2019-06-04 |
| 7611640 |
Minimizing arcing in a plasma processing chamber |
Arthur M. Howald, Andras Kuthi, Andrew D. Bailey, III |
2009-11-03 |
| 7086347 |
Apparatus and methods for minimizing arcing in a plasma processing chamber |
Arthur M. Howald, Andras Kuthi, Andrew D. Bailey, III |
2006-08-08 |
| 6692649 |
Inductively coupled plasma downstream strip module |
Wenli Collison, Michael Barnes, Tuqiang Ni, Wayne Vereb, Brian McMillin |
2004-02-17 |
| 6270862 |
Method for high density plasma chemical vapor deposition of dielectric films |
Brian McMillin, Huong Nguyen, Michael Barnes |
2001-08-07 |
| 6203657 |
Inductively coupled plasma downstream strip module |
Wenli Collison, Michael Barnes, Tuqiang Ni, Wayne Vereb, Brian McMillin |
2001-03-20 |
| 6184158 |
Inductively coupled plasma CVD |
Paul Shufflebotham, Brian McMillin, Alex Demos, Huong Nguyen, Monique Ben-Dor |
2001-02-06 |
| 5835334 |
Variable high temperature chuck for high density plasma chemical vapor deposition |
Brian McMillin, Michael Barnes, Huong Nguyen |
1998-11-10 |
