Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12394671 | Efficient removal of street test devices during wafer dicing | Michael Todd Wyant, Christopher Daniel Manack | 2025-08-19 |
| 12255097 | Splash resistant laser wafer singulation by crack length control | Yang Liu, Hao Zhang, Venkataramanan Kalyanaraman, Qing Ran, Yuan Zhang +2 more | 2025-03-18 |
| 12142586 | Efficient redistribution layer topology | Vivek Swaminathan Sridharan, Christopher Daniel Manack | 2024-11-12 |
| 11854922 | Semicondutor package substrate with die cavity and redistribution layer | Vivek Swaminathan Sridharan, Christopher Daniel Manack | 2023-12-26 |
| 11664276 | Front side laser-based wafer dicing | Matthew John Sherbin, Michael Todd Wyant, Christopher Daniel Manack, Hiroyuki Sada, Shoichi Iriguchi +2 more | 2023-05-30 |
| 11380637 | Efficient redistribution layer topology | Vivek Swaminathan Sridharan, Christopher Daniel Manack | 2022-07-05 |