RC

Rei-Lin Chu

TSMC: 11 patents #2,595 of 12,232Top 25%
Overall (All Time): #431,028 of 4,157,543Top 15%
11
Patents All Time

Issued Patents All Time

Showing 1–11 of 11 patents

Patent #TitleCo-InventorsDate
12408354 Method to reduce breakdown failure in a MIM capacitor Hsing-Lien Lin, Chii-Ming Wu, Chia-Shiung Tsai, Chung-Yi Yu 2025-09-02
12334335 Method of optimizing film deposition process in semiconductor fabrication by using gas sensor Chih-Ming Chen, Chung-Yi Yu, Yeur-Luen Tu 2025-06-17
12334475 3D trench capacitor for integrated passive devices Xin-Hua Huang, Chung-Yi Yu, Yeong-Jyh Lin 2025-06-17
12199029 MIM capacitor with a symmetrical capacitor insulator structure Hsing-Lien Lin, Cheng-Te Lee, Chii-Ming Wu, Yeur-Luen Tu, Chung-Yi Yu 2025-01-14
11862612 3D trench capacitor for integrated passive devices Xin-Hua Huang, Chung-Yi Yu, Yeong-Jyh Lin 2024-01-02
11784204 Enhanced trench isolation structure Min-Ying Tsai, Cheng-Te Lee, Ching-I Li, Chung-Yi Yu 2023-10-10
11594593 Method to reduce breakdown failure in a MIM capacitor Hsing-Lien Lin, Chii-Ming Wu, Chia-Shiung Tsai, Chung-Yi Yu 2023-02-28
11430729 MIM capacitor with a symmetrical capacitor insulator structure Hsing-Lien Lin, Cheng-Te Lee, Chii-Ming Wu, Yeur-Luen Tu, Chung-Yi Yu 2022-08-30
11232946 Method of optimizing film deposition process in semiconductor fabrication by using gas sensor Chih-Ming Chen, Chung-Yi Yu, Yeur-Luen Tu 2022-01-25
11211362 3D trench capacitor for integrated passive devices Xin-Hua Huang, Chung-Yi Yu, Yeong-Jyh Lin 2021-12-28
11152455 Method to reduce breakdown failure in a MIM capacitor Hsing-Lien Lin, Chii-Ming Wu, Chia-Shiung Tsai, Chung-Yi Yu 2021-10-19