Issued Patents All Time
Showing 1–25 of 159 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12426295 | Rough buffer layer for group III-V devices on silicon | Kuei-Ming Chen, Chi-Ming Chen | 2025-09-23 |
| 12408354 | Method to reduce breakdown failure in a MIM capacitor | Hsing-Lien Lin, Chii-Ming Wu, Chia-Shiung Tsai, Rei-Lin Chu | 2025-09-02 |
| 12398468 | Semiconductor tool having controllable ambient environment processing zones | Chiao-Chun Hsu, Chih-Ming Chen, Sheng-Hsun Lu | 2025-08-26 |
| 12389633 | Source/drains in semiconductor devices and methods of forming thereof | Chi-Ming Chen, Kuei-Ming Chen, Po-Chun Liu | 2025-08-12 |
| 12355370 | Self-aligned dielectric liner structure for protection in MEMS comb actuator | Chiao-Chun Hsu, Chih-Ming Chen, Lung Yuan Pan | 2025-07-08 |
| 12334389 | Manufacturing method of semiconductor device | Chi-Ming Chen, Kuei-Ming Chen, Po-Chun Liu, Chia-Shiung Tsai | 2025-06-17 |
| 12334475 | 3D trench capacitor for integrated passive devices | Xin-Hua Huang, Yeong-Jyh Lin, Rei-Lin Chu | 2025-06-17 |
| 12334335 | Method of optimizing film deposition process in semiconductor fabrication by using gas sensor | Rei-Lin Chu, Chih-Ming Chen, Yeur-Luen Tu | 2025-06-17 |
| 12308230 | High electron mobility transistor (HEMT) having an indium-containing layer and method of manufacturing the same | Po-Chun Liu, Chung-Chieh Hsu, Chi-Ming Chen, Chen-Hao Chiang, Min-Chang Ching | 2025-05-20 |
| 12278139 | Manufacturing method of semiconductor device | Chi-Ming Chen, Kuei-Ming Chen, Po-Chun Liu, Chia-Shiung Tsai | 2025-04-15 |
| 12272716 | Capping structure to reduce dark current in image sensors | Po-Chun Liu, Eugene Chen | 2025-04-08 |
| 12230585 | Photolithography alignment process for bonded wafers | Yeong-Jyh Lin, Ching-I Li, De-Yang Chiou, Sz-Fan Chen, Han-Jui Hu +2 more | 2025-02-18 |
| 12199029 | MIM capacitor with a symmetrical capacitor insulator structure | Hsing-Lien Lin, Cheng-Te Lee, Rei-Lin Chu, Chii-Ming Wu, Yeur-Luen Tu | 2025-01-14 |
| 12148706 | Substrate loss reduction for semiconductor devices | Xin-Hua Huang, Kuei-Ming Chen | 2024-11-19 |
| 12010918 | Piezoelectric device with hydrogen getter | Chih-Ming Chen | 2024-06-11 |
| 11984486 | Method of implanting dopants into a group III-nitride structure and device formed | Han-Chin Chiu, Chi-Ming Chen, Chen-Hao Chiang | 2024-05-14 |
| 11932534 | MEMS device having a metallization structure embedded in a dielectric structure with laterally offset sidewalls of a first portion and a second portion | Hung-Hua Lin, Chang-Ming Wu, Ping-Yin Liu, Jung-Huei Peng | 2024-03-19 |
| 11923237 | Manufacturing method of semiconductor device | Chi-Ming Chen, Kuei-Ming Chen, Po-Chun Liu, Chia-Shiung Tsai | 2024-03-05 |
| 11916022 | Photolithography alignment process for bonded wafers | Yeong-Jyh Lin, Ching-I Li, De-Yang Chiou, Sz-Fan Chen, Han-Jui Hu +2 more | 2024-02-27 |
| 11901413 | Diffusion barrier layer for source and drain structures to increase transistor performance | Kuei-Ming Chen, Chi-Ming Chen | 2024-02-13 |
| 11862612 | 3D trench capacitor for integrated passive devices | Xin-Hua Huang, Yeong-Jyh Lin, Rei-Lin Chu | 2024-01-02 |
| 11862720 | Rough buffer layer for group III-V devices on silicon | Kuei-Ming Chen, Chi-Ming Chen | 2024-01-02 |
| 11832520 | Voltage breakdown uniformity in piezoelectric structure for piezoelectric devices | Chih-Ming Chen, Chiao-Chun Hsu | 2023-11-28 |
| 11824099 | Source/drains in semiconductor devices and methods of forming thereof | Chi-Ming Chen, Kuei-Ming Chen, Po-Chun Liu | 2023-11-21 |
| 11824077 | Capping structure to reduce dark current in image sensors | Po-Chun Liu, Eugene Chen | 2023-11-21 |