Issued Patents All Time
Showing 1–25 of 99 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12376401 | Methods of forming optical modules | Chun-Wen Cheng, Yi-Chien Wu | 2025-07-29 |
| 12303888 | Method to produce chemical pattern in micro-fluidic structure | Shang-Ying Tsai, Li-Min Hung, Shane Bowen, Hui Han, Danny Yuan Chan +1 more | 2025-05-20 |
| 12221337 | Semiconductor MEMS structure | Yuan-Chih Hsieh, Hsing-Lien Lin, Yi-Chien Wu | 2025-02-11 |
| 11932534 | MEMS device having a metallization structure embedded in a dielectric structure with laterally offset sidewalls of a first portion and a second portion | Hung-Hua Lin, Chang-Ming Wu, Chung-Yi Yu, Ping-Yin Liu | 2024-03-19 |
| 11767216 | Semiconductor MEMS structure | Yuan-Chih Hsieh, Hsing-Lien Lin, Yi-Chien Wu | 2023-09-26 |
| 11678133 | Structure for integrated microphone | Chia-Hua Chu, Chun-Wen Cheng, Chin-Yi Cho, Li-Min Hung, Yao-Te Huang | 2023-06-13 |
| 11505454 | MEMS structure and manufacturing method thereof | Kang-Che HUANG, Yi-Chien Wu, Shiang-Chi Lin, Chun-Wen Cheng | 2022-11-22 |
| 11312623 | Semiconductor structure for MEMS device | Yu-Chia Liu, Chia-Hua Chu, Chun-Wen Cheng | 2022-04-26 |
| 11298697 | Method to produce chemical pattern in micro-fluidic structure | Shang-Ying Tsai, Li-Min Hung, Shane Bowen, Hui Han, Danny Yuan Chan +1 more | 2022-04-12 |
| 11279615 | Method for manufacturing a MEMS device by first hybrid bonding a CMOS wafer to a MEMS wafer | Hung-Hua Lin, Chang-Ming Wu, Chung-Yi Yu, Ping-Yin Liu | 2022-03-22 |
| 11148936 | CMOS-MEMS structure and method of forming the same | Chia-Hua Chu, Fei-Lung Lai, Shiang-Chi Lin | 2021-10-19 |
| 11130670 | MEMS devices with an element having varying widths | Shang-Ying Tsai, Hung-Hua Lin, Hsin-Ting Huang, Lung Yuan Pan, Yao-Te Huang | 2021-09-28 |
| 11117796 | MEMS devices including MEMS dies and connectors thereto | Chun-Wen Cheng, Shang-Ying Tsai, Hung-Chia Tsai, Yi-Chuan Teng | 2021-09-14 |
| 11104129 | MEMS devices and methods of fabrication thereof | Chun-Ren Cheng, Jiou-Kang Lee, Shang-Ying Tsai, Ting-Hau Wu | 2021-08-31 |
| 11027310 | Fluid deposition apparatus and method | Chun-Wen Cheng, Yi-Shao Liu, Fei-Lung Lai, Shang-Ying Tsai | 2021-06-08 |
| 10787360 | Semiconductor MEMS structure | Yuan-Chih Hsieh, Hsing-Lien Lin, Yi-Chien Wu | 2020-09-29 |
| 10779100 | Method for manufacturing a microphone | Chia-Hua Chu, Chun-Wen Cheng, Chin-Yi Cho, Li-Min Hung, Yao-Te Huang | 2020-09-15 |
| 10752497 | Semiconductor structure for MEMS device | Yu-Chia Liu, Chia-Hua Chu, Chun-Wen Cheng | 2020-08-25 |
| 10710871 | MEMS devices including MEMS dies and connectors thereto | Chun-Wen Cheng, Shang-Ying Tsai, Hung-Chia Tsai, Yi-Chuan Teng | 2020-07-14 |
| 10688786 | MEMS devices and methods of fabrication thereof | Chun-Ren Cheng, Jiou-Kang Lee, Shang-Ying Tsai, Ting-Hau Wu | 2020-06-23 |
| 10508023 | MEMS devices including MEMS dies and connectors thereto | Chun-Wen Cheng, Shang-Ying Tsai, Hung-Chia Tsai, Yi-Chuan Teng | 2019-12-17 |
| 10508027 | CMOS-MEMS structure and method of forming the same | Chia-Hua Chu, Fei-Lung Lai, Shiang-Chi Lin | 2019-12-17 |
| 10486153 | Method to produce chemical pattern in micro-fluidic structure | Shang-Ying Tsai, Li-Min Hung | 2019-11-26 |
| 10351417 | MEMS device with viewer window and manufacturing method thereof | Chun-Wen Cheng, Chi-Hang Chin, Chia-Hua Chu, Shang-Ying Tsai | 2019-07-16 |
| 10294098 | Method for manufacturing a MEMS device by first hybrid bonding a CMOS wafer to a MEMS wafer | Hung-Hua Lin, Chang-Ming Wu, Chung-Yi Yu, Ping-Yin Liu | 2019-05-21 |