Issued Patents All Time
Showing 51–75 of 99 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9545691 | Method of removing waste of substrate and waste removing device thereof | Chin-Yi Cho, Yi-Chuan Teng, Shang-Ying Tsai, Li-Min Hung, Yao-Te Huang | 2017-01-17 |
| 9533876 | MEMS structures and methods for forming the same | Ping-Yin Liu, Xin-Hua Huang, Hsin-Ting Huang, Yuan-Chih Hsieh, Lan-Lin Chao +2 more | 2017-01-03 |
| 9469524 | Semiconductor device with through molding vias and method of making the same | Chun-Wen Cheng, Shang-Ying Tsai, Hung-Chia Tsai, Yi-Chuan Teng | 2016-10-18 |
| 9462402 | Monolithic complementary metal-oxide semiconductor (CMOS)-integrated silicon microphone | Chin-Yi Cho, Chia-Hua Chu, Chun-Wen Cheng, Yao-Te Huang | 2016-10-04 |
| 9394161 | MEMS and CMOS integration with low-temperature bonding | Chun-Wen Cheng, Chia-Hua Chu | 2016-07-19 |
| 9355896 | Package systems | Chia-Pao Shu, Chun-Wen Cheng, Kuei-Sung Chang, Hsin-Ting Huang, Shang-Ying Tsai | 2016-05-31 |
| 9352956 | MEMS devices and methods for forming same | Chun-Wen Cheng, Shang-Ying Tsai, Hung-Chia Tsai, Yi-Chuan Teng | 2016-05-31 |
| 9352315 | Method to produce chemical pattern in micro-fluidic structure | Shang-Ying Tsai, Li-Min Hung | 2016-05-31 |
| 9293445 | Wafer level packaging bond | Ping-Yin Liu, Li-Chen CHU, Hung-Hua Lin, H. T. Huang, Yuan-Chih Hsieh +3 more | 2016-03-22 |
| 9269679 | Wafer level packaging techniques | Yi-Chuan Teng, Shang-Ying Tsai, Li-Min Hung, Yao-Te Huang, Chin-Yi Cho | 2016-02-23 |
| 9264833 | Structure and method for integrated microphone | Chia-Hua Chu, Yao-Te Huang, Chin-Yi Cho, Li-Min Hung, Chun-Wen Cheng | 2016-02-16 |
| 9238581 | Triple-axis MEMS accelerometer | Ting-Hau Wu, Chun-Ren Cheng, Shang-Ying Tsai, Jiou-Kang Lee | 2016-01-19 |
| 9233839 | MEMS device and method of forming the same | Yu-Chia Liu, Chia-Hua Chu, Kuei-Sung Chang, Chun-Wen Cheng | 2016-01-12 |
| 9212050 | Cap and substrate electrical connection at wafer level | — | 2015-12-15 |
| 9181083 | MEMS devices and methods of forming the same | Shang-Ying Tsai, Hung-Hua Lin, Lung Yuan Pan, Yao-Te Huang, Hsin-Ting Huang | 2015-11-10 |
| 9150404 | Semiconductor device with through molding vias | Chun-Wen Cheng, Shang-Ying Tsai, Hung-Chia Tsai, Yi-Chuan Teng | 2015-10-06 |
| 9138994 | MEMS devices and methods of fabrication thereof | Chun-Ren Cheng, Jiou-Kang Lee, Shang-Ying Tsai, Ting-Hau Wu | 2015-09-22 |
| 9114396 | Method of making flowcell with micro-fluid structure | Shang-Ying Tsai, Li-Ming Hung | 2015-08-25 |
| 9112001 | Package systems and manufacturing methods thereof | Chia-Pao Shu, Chun-Wen Cheng, Kuei-Sung Chang, Hsin-Ting Huang, Shang-Ying Tsai | 2015-08-18 |
| 9054121 | MEMS structures and methods for forming the same | Ping-Yin Liu, Xin-Hua Huang, Hsin-Ting Huang, Yuan-Chih Hsieh, Lan-Lin Chao +2 more | 2015-06-09 |
| 9034677 | MEMS device and method of formation thereof | Hsin-Ting Huang, Shang-Ying Tsai, Yao-Te Huang, Ming-Tung Wu, Ping-Yin Liu +2 more | 2015-05-19 |
| 8941152 | Semiconductor device | Chun-Wen Cheng, Shang-Ying Tsai, Hung-Chia Tsai, Yi-Chuan Teng | 2015-01-27 |
| 8905293 | Self-removal anti-stiction coating for bonding process | Ping-Yin Liu, Li-Cheng Chu, Hung-Hua Lin, Shang-Ying Tsai, Yuan-Chih Hsieh +3 more | 2014-12-09 |
| 8900905 | MEMS device and method of forming the same | Yu-Chia Liu, Chia-Hua Chu, Kuei-Sung Chang, Chun-Wen Cheng | 2014-12-02 |
| 8853801 | MEMS devices and methods of forming the same | Shang-Ying Tsai, Hsin-Ting Huang, Yao-Te Huang, Lung Yuan Pan, Hung-Hua Lin | 2014-10-07 |