Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9365416 | Structure and method for motion sensor | Wen-Chuan Tai, Chia-Ming Hung, Hsiang-Fu Chen | 2016-06-14 |
| 9355896 | Package systems | Chun-Wen Cheng, Kuei-Sung Chang, Hsin-Ting Huang, Shang-Ying Tsai, Jung-Huei Peng | 2016-05-31 |
| 9266714 | Micro-electro mechanical system (MEMS) structures and methods of forming the same | Chia-Ming Hung, Wen-Chuan Tai, Hung-Sen Wang, Hsiang-Fu Chen, Alex Kalnitsky | 2016-02-23 |
| 9112001 | Package systems and manufacturing methods thereof | Chun-Wen Cheng, Kuei-Sung Chang, Hsin-Ting Huang, Shang-Ying Tsai, Jung-Huei Peng | 2015-08-18 |
| 9000578 | Package systems having an opening in a substrate thereof and manufacturing methods thereof | Chun-Wen Cheng, Kuei-Sung Chang | 2015-04-07 |
| 8921145 | Hybrid MEMS bump design to prevent in-process and in-use stiction | Kelvin Tai, Calvin Hung, Benior Chen | 2014-12-30 |
| 8723280 | Hybrid MEMS bump design to prevent in-process and in-use stiction | Wen-Chuan Tai, Chia-Ming Hung, Hsiang-Fu Chen | 2014-05-13 |
| 8716852 | Micro-electro mechanical systems (MEMS) having outgasing prevention structures and methods of forming the same | Chia-Ming Hung, Wen-Chuan Tai, Hung-Sen Wang, Hsiang-Fu Chen, Alex Kalnitsky | 2014-05-06 |
| 8674495 | Package systems having a eutectic bonding material and manufacturing methods thereof | Chun-Wen Cheng, Kuei-Sung Chang, Hsin-Ting Huang, Shang-Ying Tsai, Jung-Huei Peng | 2014-03-18 |
| 8633554 | MEMS device etch stop | Chia-Hua Chu, Yi Heng Tsai, Kai-Chih Liang, Li-Cheng Chu, Kuei-Sung Chang +2 more | 2014-01-21 |
| 8629516 | Bulk silicon moving member with dimple | Chia-Hua Chu | 2014-01-14 |
| 8368152 | MEMS device etch stop | Chia-Hua Chu, Yi Heng Tsai, Kai-Chih Liang, Li-Cheng Chu, Kuei-Sung Chang +2 more | 2013-02-05 |
| 8338207 | Bulk silicon moving member with dimple | Chia-Hua Chu | 2012-12-25 |