Issued Patents All Time
Showing 1–25 of 48 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12392774 | Biosensor system with integrated microneedle | Allen Timothy Chang, Jui-Cheng Huang, Yu-Jie Huang | 2025-08-19 |
| 12362240 | Method and system for detecting semiconductor device | Fan Hu, Hsiang-Fu Chen, I-Chieh Huang, Tzu-Chieh Wei, Kang-Yi Lien | 2025-07-15 |
| 12269735 | Dielectric protection layer configured to increase performance of mems device | Hsiang-Fu Chen, Chia-Ming Hung, I-Hsuan Chiu, Fan Hu | 2025-04-08 |
| 12215016 | Piezoelectric anti-stiction structure for microelectromechanical systems | Fan Hu, Chun-Ren Cheng, Hsiang-Fu Chen | 2025-02-04 |
| 12123871 | Biosensor system with integrated microneedle | Allen Timothy Chang, Jui-Cheng Huang, Yu-Jie Huang | 2024-10-22 |
| 12123846 | Wafer-level packaging of solid-state biosensor, microfluidics, and through-silicon via | Allen Timothy Chang, Jui-Cheng Huang, Yu-Jie Huang | 2024-10-22 |
| 12015001 | Bonding structure and method thereof | Fan Hu, Hsiang-Fu Chen, Li Peng | 2024-06-18 |
| 11834325 | Piezoelectric anti-stiction structure for microelectromechanical systems | Fan Hu, Chun-Ren Cheng, Hsiang-Fu Chen | 2023-12-05 |
| 11747298 | Wafer-level packaging of solid-state biosensor, microfluidics, and through-silicon via | Allen Timothy Chang, Jui-Cheng Huang, Yu-Jie Huang | 2023-09-05 |
| 11667522 | MEMS package comprising multi-depth trenches | Fan Hu | 2023-06-06 |
| 11365115 | Piezoelectric anti-stiction structure for microelectromechanical systems | Fan Hu, Chun-Ren Cheng, Hsiang-Fu Chen | 2022-06-21 |
| 11289568 | Reduction of electric field enhanced moisture penetration by metal shielding | Chi-Yuan Shih, Kai-Fung Chang, Shih-Fen Huang, Yi-Chuan Teng, Yi Heng Tsai +9 more | 2022-03-29 |
| 11220422 | MEMS device | Fan Hu, Hsiang-Fu Chen, Chun-Ren Cheng | 2022-01-11 |
| 10981781 | Semiconductor arrangement and formation thereof | Hsin-Ting Huang, Hsiang-Fu Chen, Chia-Ming Hung, Shao-Chi Yu, Hung-Hua Lin +1 more | 2021-04-20 |
| 10961118 | Wafer level integrated MEMS device enabled by silicon pillar and smart cap | Yi-Chia Lee, Chin-Min Lin, Cheng San Chou, Hsiang-Fu Chen, Ching-Kai Shen +2 more | 2021-03-30 |
| 10899608 | Wafer level integrated MEMS device enabled by silicon pillar and smart cap | Yi-Chia Lee, Chin-Min Lin, Cheng San Chou, Hsiang-Fu Chen, Ching-Kai Shen +2 more | 2021-01-26 |
| 10865102 | Multi-depth MEMS package | Fan Hu | 2020-12-15 |
| 10752495 | Method for forming multi-depth MEMS package | Fan Hu | 2020-08-25 |
| 10618801 | MEMS structure with bilayer stopper and method for forming the same | Hsiang-Fu Chen, Fan Hu | 2020-04-14 |
| 10556790 | Method for forming multi-depth MEMS package | Fan Hu | 2020-02-11 |
| 10556792 | Wafer level integrated MEMS device enabled by silicon pillar and smart cap | Yi-Chia Lee, Chin-Min Lin, Cheng San Chou, Hsiang-Fu Chen, Ching-Kai Shen +2 more | 2020-02-11 |
| 10464808 | Semiconductor arrangement and formation thereof | Hsin-Ting Huang, Hsiang-Fu Chen, Chia-Ming Hung, Shao-Chi Yu, Hung-Hua Lin +1 more | 2019-11-05 |
| 10392244 | Method for sealing a cavity of a microelectromechanical systems (MEMS) device using a seal layer covering or lining a hole in fluid communication with the cavity | Chia-Ming Hung, Shao-Chi Yu, Hsiang-Fu Chen, Hsin-Ting Huang | 2019-08-27 |
| 10266399 | Apparatus and method of manufacturing for combo MEMS device accommodating different working pressures | Jiou-Kang Lee | 2019-04-23 |
| 10266396 | MEMS device with enhanced sensing structure and manufacturing method thereof | Ching-Kai Shen, Chia-Ming Hung, Hsiang-Fu Chen, Jung-Huei Peng, Chun-Wen Cheng | 2019-04-23 |