YL

Yi-Chia Lee

VU Versum Materials Us: 26 patents #6 of 174Top 4%
Air Products And Chemicals: 6 patents #343 of 1,997Top 20%
TSMC: 3 patents #5,465 of 12,232Top 45%
UM United Microelectronics: 2 patents #1,942 of 4,560Top 45%
Overall (All Time): #88,301 of 4,157,543Top 3%
37
Patents All Time

Issued Patents All Time

Showing 25 most recent of 37 patents

Patent #TitleCo-InventorsDate
12298669 Composition comprising three alkanolamines and a hydroxylamine for removing etch residues Laisheng Sun, Lili Wang, Aiping Wu, Tianniu Chen 2025-05-13
12281251 Etching composition and method for selectively removing silicon nitride during manufacture of a semiconductor device Jhih Kuei Ge, Wen Dar Liu, Aiping Wu, Laisheng Sun 2025-04-22
12110435 Etching composition and method for selectively removing silicon nitride during manufacture of a semiconductor device Jhih Kuei Ge, Wen Dar Liu, Aiping Wu, Laisheng Sun 2024-10-08
12110436 Co/Cu selective wet etchant Chung-Yi Chang, Wen Dar Liu 2024-10-08
11955341 Etching solution and method for selectively removing silicon nitride during manufacture of a semiconductor device Jhih Kuei Ge, Wen Dar Liu 2024-04-09
11946148 Hafnium oxide corrosion inhibitor Wen Dar Liu 2024-04-02
11929257 Etching solution and method for aluminum nitride Chung-Yi Chang, Wen Dar Liu 2024-03-12
11499236 Etching solution for tungsten word line recess Jhih Kuei Ge, Wen Dar Liu 2022-11-15
11186771 Etching solution for selectively removing silicon nitride during manufacture of a semiconductor device Wen Dar Liu 2021-11-30
11180697 Etching solution having silicon oxide corrosion inhibitor and method of using the same Wen Dar Liu, Chung-Yi Chang 2021-11-23
11175587 Stripper solutions and methods of using stripper solutions Jhih Kuei Ge, Wen Dar Liu, Chi-Hsien Kuo 2021-11-16
11091727 Post etch residue cleaning compositions and methods of using the same Laisheng Sun, Lili Wang, Aiping Wu 2021-08-17
11035044 Etching solution for tungsten and GST films Wen Dar Liu, Laisheng Sun, Tianniu Chen, Gang C. Han-Adebekun 2021-06-15
11017995 Composition for TiN hard mask removal and etch residue cleaning Chao-Hsiang Chen, Wen Dar Liu, Chung-Yi Chang 2021-05-25
10961118 Wafer level integrated MEMS device enabled by silicon pillar and smart cap Chin-Min Lin, Cheng San Chou, Hsiang-Fu Chen, Wen-Chuan Tai, Ching-Kai Shen +2 more 2021-03-30
10954480 Compositions and methods for preventing collapse of high aspect ratio structures during drying Jhih Kuei Ge, Wen Dar Liu, Tianniu Chen 2021-03-23
10934484 Etching solution for selectively removing silicon-germanium alloy from a silicon-germanium/ germanium stack during manufacture of a semiconductor device Wen Dar Liu 2021-03-02
10934485 Etching solution for selectively removing silicon over silicon-germanium alloy from a silicon-germanium/ silicon stack during manufacture of a semiconductor device Wen Dar Liu, Andrew J. Adamczyk 2021-03-02
10899608 Wafer level integrated MEMS device enabled by silicon pillar and smart cap Chin-Min Lin, Cheng San Chou, Hsiang-Fu Chen, Wen-Chuan Tai, Ching-Kai Shen +2 more 2021-01-26
10879076 Etching solution for selectively removing silicon-germanium alloy from a silicon-germanium/silicon stack during manufacture of a semiconductor device Wen Dar Liu, Andrew J. Adamczyk 2020-12-29
10870799 Etching solution for selectively removing tantalum nitride over titanium nitride during manufacture of a semiconductor device Wen Dar Liu 2020-12-22
10711227 TiN hard mask and etch residue removal Wen Dar Liu, William Jack Casteel, Jr., Tianniu Chen, Rajiv Krishan Agarwal, Madhukar Bhaskara Rao 2020-07-14
10556792 Wafer level integrated MEMS device enabled by silicon pillar and smart cap Chin-Min Lin, Cheng San Chou, Hsiang-Fu Chen, Wen-Chuan Tai, Ching-Kai Shen +2 more 2020-02-11
10400167 Etching compositions and methods for using same Wen Dar Liu, Tianniu Chen, Thomas Mebrahtu, Aiping Wu, Edward Tseng +1 more 2019-09-03
10301580 Stripping compositions having high WN/W etching selectivity Wen Dar Liu, Tianniu Chen, William Jack Casteel, Jr., Seiji Inaoka, Gene Everad Parris 2019-05-28