Issued Patents All Time
Showing 1–25 of 40 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12400926 | Semiconductor device and method of manufacture | You-Ru Lin, Sheng Kai YEH, Jen-Yuan Chang, Chi-Yuan Shih, Chia-Ming Hung +1 more | 2025-08-26 |
| 12362240 | Method and system for detecting semiconductor device | Fan Hu, Wen-Chuan Tai, I-Chieh Huang, Tzu-Chieh Wei, Kang-Yi Lien | 2025-07-15 |
| 12304807 | Semiconductor device comprising different types of microelectromechanical systems devices | Chia-Ming Hung, I-Hsuan Chiu | 2025-05-20 |
| 12269735 | Dielectric protection layer configured to increase performance of mems device | Wen-Chuan Tai, Chia-Ming Hung, I-Hsuan Chiu, Fan Hu | 2025-04-08 |
| 12257602 | Semiconductor device having microelectromechanical systems devices with improved cavity pressure uniformity | I-Hsuan Chiu, Chia-Ming Hung, Li Peng | 2025-03-25 |
| 12215016 | Piezoelectric anti-stiction structure for microelectromechanical systems | Fan Hu, Chun-Ren Cheng, Wen-Chuan Tai | 2025-02-04 |
| 12162749 | Bond wave optimization method and device | Kang-Yi Lien, I-Hsuan Chiu, Yi Huang, Chia-Ming Hung, Kuan-Chi Tsai | 2024-12-10 |
| 12015001 | Bonding structure and method thereof | Wen-Chuan Tai, Fan Hu, Li Peng | 2024-06-18 |
| 11851323 | Semiconductor device comprising different types of microelectromechanical systems devices | Chia-Ming Hung, I-Hsuan Chiu | 2023-12-26 |
| 11834325 | Piezoelectric anti-stiction structure for microelectromechanical systems | Fan Hu, Chun-Ren Cheng, Wen-Chuan Tai | 2023-12-05 |
| 11834332 | Bond wave optimization method and device | Kang-Yi Lien, Kuan-Chi Tsai, Yi Huang, Chia-Ming Hung, I-Hsuan Chiu | 2023-12-05 |
| 11491510 | Semiconductor device having microelectromechanical systems devices with improved cavity pressure uniformity | I-Hsuan Chiu, Chia-Ming Hung, Li Peng | 2022-11-08 |
| 11365115 | Piezoelectric anti-stiction structure for microelectromechanical systems | Fan Hu, Chun-Ren Cheng, Wen-Chuan Tai | 2022-06-21 |
| 11220422 | MEMS device | Fan Hu, Wen-Chuan Tai, Chun-Ren Cheng | 2022-01-11 |
| 10981781 | Semiconductor arrangement and formation thereof | Hsin-Ting Huang, Wen-Chuan Tai, Chia-Ming Hung, Shao-Chi Yu, Hung-Hua Lin +1 more | 2021-04-20 |
| 10961118 | Wafer level integrated MEMS device enabled by silicon pillar and smart cap | Yi-Chia Lee, Chin-Min Lin, Cheng San Chou, Wen-Chuan Tai, Ching-Kai Shen +2 more | 2021-03-30 |
| 10899608 | Wafer level integrated MEMS device enabled by silicon pillar and smart cap | Yi-Chia Lee, Chin-Min Lin, Cheng San Chou, Wen-Chuan Tai, Ching-Kai Shen +2 more | 2021-01-26 |
| 10618801 | MEMS structure with bilayer stopper and method for forming the same | Wen-Chuan Tai, Fan Hu | 2020-04-14 |
| 10556792 | Wafer level integrated MEMS device enabled by silicon pillar and smart cap | Yi-Chia Lee, Chin-Min Lin, Cheng San Chou, Wen-Chuan Tai, Ching-Kai Shen +2 more | 2020-02-11 |
| 10464808 | Semiconductor arrangement and formation thereof | Hsin-Ting Huang, Wen-Chuan Tai, Chia-Ming Hung, Shao-Chi Yu, Hung-Hua Lin +1 more | 2019-11-05 |
| 10392244 | Method for sealing a cavity of a microelectromechanical systems (MEMS) device using a seal layer covering or lining a hole in fluid communication with the cavity | Chia-Ming Hung, Shao-Chi Yu, Wen-Chuan Tai, Hsin-Ting Huang | 2019-08-27 |
| 10266396 | MEMS device with enhanced sensing structure and manufacturing method thereof | Ching-Kai Shen, Wen-Chuan Tai, Chia-Ming Hung, Jung-Huei Peng, Chun-Wen Cheng | 2019-04-23 |
| 10131540 | Structure and method to mitigate soldering offset for wafer-level chip scale package (WLCSP) applications | Shao-Chi Yu, Chia-Ming Hung, Hsin-Ting Huang, Allen Timothy Chang, Wen-Chuan Tai | 2018-11-20 |
| 10053361 | Method of selectively removing an anti-stiction layer on a eutectic bonding area | Yuan-Chih Hsieh, Hung-Hua Lin, Wen-Chuan Tai | 2018-08-21 |
| 9856139 | Microelectromechanical systems (MEMS) devices at different pressures | Hsin-Ting Huang, Wen-Chuan Tai, Shao-Chi Yu, Chia-Ming Hung, Allen Timothy Chang +2 more | 2018-01-02 |