Issued Patents All Time
Showing 1–25 of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12421245 | Pharmaceutically acceptable acid salt of free base of GLP1 receptor agonist, and preparation method therefor | Haiwen Hu, Li Fang, Xinjie ZHOU, Fenfen CHEN | 2025-09-23 |
| 12362240 | Method and system for detecting semiconductor device | Wen-Chuan Tai, Hsiang-Fu Chen, I-Chieh Huang, Tzu-Chieh Wei, Kang-Yi Lien | 2025-07-15 |
| D1072973 | Toy | — | 2025-04-29 |
| D1072972 | Plush toy | — | 2025-04-29 |
| 12269735 | Dielectric protection layer configured to increase performance of mems device | Wen-Chuan Tai, Hsiang-Fu Chen, Chia-Ming Hung, I-Hsuan Chiu | 2025-04-08 |
| 12215016 | Piezoelectric anti-stiction structure for microelectromechanical systems | Chun-Ren Cheng, Hsiang-Fu Chen, Wen-Chuan Tai | 2025-02-04 |
| 12194122 | Combination of modified starch/C13-C15 fatty acid/clay | Masanori Orita | 2025-01-14 |
| 12186418 | Foaming composition | Nahoko Nakashima | 2025-01-07 |
| 12015001 | Bonding structure and method thereof | Wen-Chuan Tai, Hsiang-Fu Chen, Li Peng | 2024-06-18 |
| 11984261 | Integration scheme for breakdown voltage enhancement of a piezoelectric metal-insulator-metal device | Anderson Lin, Chun-Ren Cheng, Chi-Yuan Shih, Shih-Fen Huang, Yi-Chuan Teng +6 more | 2024-05-14 |
| 11834325 | Piezoelectric anti-stiction structure for microelectromechanical systems | Chun-Ren Cheng, Hsiang-Fu Chen, Wen-Chuan Tai | 2023-12-05 |
| 11667522 | MEMS package comprising multi-depth trenches | Wen-Chuan Tai | 2023-06-06 |
| 11591342 | Heterocyclic compound, application thereof and pharmaceutical composition comprising same | Yonghan Hu, Dongdong Wu, Wei Peng, Xin Li, Bin Huang +2 more | 2023-02-28 |
| 11465048 | Method and device for executing attack operation, storage medium and electronic device | Jie Ou, Jiacheng Wei, Ruihan YANG | 2022-10-11 |
| 11365115 | Piezoelectric anti-stiction structure for microelectromechanical systems | Chun-Ren Cheng, Hsiang-Fu Chen, Wen-Chuan Tai | 2022-06-21 |
| 11289568 | Reduction of electric field enhanced moisture penetration by metal shielding | Chi-Yuan Shih, Kai-Fung Chang, Shih-Fen Huang, Wen-Chuan Tai, Yi-Chuan Teng +9 more | 2022-03-29 |
| 11220422 | MEMS device | Wen-Chuan Tai, Hsiang-Fu Chen, Chun-Ren Cheng | 2022-01-11 |
| 11107630 | Integration scheme for breakdown voltage enhancement of a piezoelectric metal-insulator-metal device | Anderson Lin, Chun-Ren Cheng, Chi-Yuan Shih, Shih-Fen Huang, Yi-Chuan Teng +6 more | 2021-08-31 |
| 10961118 | Wafer level integrated MEMS device enabled by silicon pillar and smart cap | Yi-Chia Lee, Chin-Min Lin, Cheng San Chou, Hsiang-Fu Chen, Wen-Chuan Tai +2 more | 2021-03-30 |
| 10899608 | Wafer level integrated MEMS device enabled by silicon pillar and smart cap | Yi-Chia Lee, Chin-Min Lin, Cheng San Chou, Hsiang-Fu Chen, Wen-Chuan Tai +2 more | 2021-01-26 |
| 10898420 | Compositions containing phenolic compounds having synergistic antioxidant benefits | Zhi Pan, Ashleigh Murtaugh, Yan Yu, Irina Gorodissky | 2021-01-26 |
| 10865102 | Multi-depth MEMS package | Wen-Chuan Tai | 2020-12-15 |
| 10828515 | Compositions containing phenolic compounds having synergistic antioxidant benefits | Zhi Pan, Ashleigh Murtaugh | 2020-11-10 |
| 10752495 | Method for forming multi-depth MEMS package | Wen-Chuan Tai | 2020-08-25 |
| 10618801 | MEMS structure with bilayer stopper and method for forming the same | Wen-Chuan Tai, Hsiang-Fu Chen | 2020-04-14 |