Issued Patents All Time
Showing 26–27 of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10556792 | Wafer level integrated MEMS device enabled by silicon pillar and smart cap | Yi-Chia Lee, Chin-Min Lin, Cheng San Chou, Hsiang-Fu Chen, Wen-Chuan Tai +2 more | 2020-02-11 |
| 10556790 | Method for forming multi-depth MEMS package | Wen-Chuan Tai | 2020-02-11 |