Issued Patents All Time
Showing 1–25 of 92 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12334333 | Methods for patterning a silicon oxide-silicon nitride-silicon oxide stack and structures formed by the same | Yi-Ren Wang | 2025-06-17 |
| 12255062 | Integrate rinse module in hybrid bonding platform | Xin-Hua Huang, Ping-Yin Liu, Hung-Hua Lin, Hsun-Chung Kuang, Lan-Lin Chao +2 more | 2025-03-18 |
| 12221337 | Semiconductor MEMS structure | Hsing-Lien Lin, Jung-Huei Peng, Yi-Chien Wu | 2025-02-11 |
| 12185631 | Pizoelectric MEMS device with electrodes having low surface roughness | Yi-Ren Wang, Hung-Hua Lin | 2024-12-31 |
| 12151932 | Microelectromechanical systems device having a mechanically robust anti-stiction/outgassing structure | Kuei-Sung Chang, Chun-Wen Cheng, Fei-Lung Lai, Shing-Chyang Pan, Yi-Ren Wang | 2024-11-26 |
| 12139399 | Conductive bond structure to increase membrane sensitivity in MEMS device | Hung-Hua Lin, Chia-Ming Hung, Xin-Hua Huang | 2024-11-12 |
| 12134824 | Undercut-free patterned aluminum nitride structure and methods for forming the same | Yi-Ren Wang, Hung-Hua Lin | 2024-11-05 |
| 11854795 | Integrate rinse module in hybrid bonding platform | Xin-Hua Huang, Ping-Yin Liu, Hung-Hua Lin, Hsun-Chung Kuang, Lan-Lin Chao +2 more | 2023-12-26 |
| 11814283 | Microelectromechanical systems device having a mechanically robust anti-stiction/outgassing structure | Kuei-Sung Chang, Chun-Wen Cheng, Fei-Lung Lai, Shing-Chyang Pan, Yi-Ren Wang | 2023-11-14 |
| 11812664 | Pizoelectric MEMS device with electrodes having low surface roughness | Yi-Ren Wang, Hung-Hua Lin | 2023-11-07 |
| 11767216 | Semiconductor MEMS structure | Hsing-Lien Lin, Jung-Huei Peng, Yi-Chien Wu | 2023-09-26 |
| 11713241 | Packaging method and associated packaging structure | Chih-Ming Chen, Chung-Yi Yu | 2023-08-01 |
| 11697588 | Structure for microelectromechanical systems (MEMS) devices to control pressure at high temperature | Yi-Ren Wang, Shing-Chyang Pan | 2023-07-11 |
| 11634318 | MEMs using outgassing material to adjust the pressure level in a cavity | Hung-Hua Lin | 2023-04-25 |
| 11542153 | Segmented pedestal for mounting device on chip | Lee-Chuan Tseng | 2023-01-03 |
| 11521846 | Methods for patterning a silicon oxide-silicon nitride-silicon oxide stack and structures formed by the same | Yi-Ren Wang | 2022-12-06 |
| 11371133 | Undercut-free patterned aluminum nitride structure and methods for forming the same | Yi-Ren Wang, Hung-Hua Lin | 2022-06-28 |
| 11292715 | Conductive bond structure to increase membrane sensitivity in MEMS device | Hung-Hua Lin, Chia-Ming Hung, Xin-Hua Huang | 2022-04-05 |
| 11282697 | Integrate rinse module in hybrid bonding platform | Xin-Hua Huang, Ping-Yin Liu, Hung-Hua Lin, Hsun-Chung Kuang, Lan-Lin Chao +2 more | 2022-03-22 |
| 11198606 | Structure for microelectromechanical systems (MEMS) devices to control pressure at high temperature | Yi-Ren Wang, Shing-Chyang Pan | 2021-12-14 |
| 11084715 | Segmented pedestal for mounting device on chip | Lee-Chuan Tseng | 2021-08-10 |
| 11078075 | Packaging method and associated packaging structure | Chih-Ming Chen, Chung-Yi Yu | 2021-08-03 |
| 11050012 | Method to protect electrodes from oxidation in a MEMS device | Yi-Ren Wang, Hung-Hua Lin | 2021-06-29 |
| 11040870 | Microelectromechanical systems device having a mechanically robust anti-stiction/outgassing structure | Kuei-Sung Chang, Chun-Wen Cheng, Fei-Lung Lai, Shing-Chyang Pan, Yi-Ren Wang | 2021-06-22 |
| 11014805 | Method of forming semiconductor package and semiconductor package | Chun-Wen Cheng, Hung-Chia Tsai, Lan-Lin Chao, Ping-Yin Liu | 2021-05-25 |