Issued Patents All Time
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11117796 | MEMS devices including MEMS dies and connectors thereto | Chun-Wen Cheng, Jung-Huei Peng, Shang-Ying Tsai, Yi-Chuan Teng | 2021-09-14 |
| 11014805 | Method of forming semiconductor package and semiconductor package | Chun-Wen Cheng, Lan-Lin Chao, Yuan-Chih Hsieh, Ping-Yin Liu | 2021-05-25 |
| 10710871 | MEMS devices including MEMS dies and connectors thereto | Chun-Wen Cheng, Jung-Huei Peng, Shang-Ying Tsai, Yi-Chuan Teng | 2020-07-14 |
| 10508023 | MEMS devices including MEMS dies and connectors thereto | Chun-Wen Cheng, Jung-Huei Peng, Shang-Ying Tsai, Yi-Chuan Teng | 2019-12-17 |
| 10384933 | Method of forming micro electromechanical system sensor | Chun-Wen Cheng, Lan-Lin Chao, Yuan-Chih Hsieh, Ping-Yin Liu | 2019-08-20 |
| 10155659 | Vacuum sealed MEMS and CMOS package | Chun-Wen Cheng, Yi-Chuan Teng, Chia-Hua Chu | 2018-12-18 |
| 9919914 | MEMS devices including MEMS dies and connectors thereto | Chun-Wen Cheng, Jung-Huei Peng, Shang-Ying Tsai, Yi-Chuan Teng | 2018-03-20 |
| 9776856 | Vacuum sealed MEMS and CMOS package | Chun-Wen Cheng, Yi-Chuan Teng, Chia-Hua Chu | 2017-10-03 |
| 9725310 | Micro electromechanical system sensor and method of forming the same | Chun-Wen Cheng, Lan-Lin Chao, Yuan-Chih Hsieh, Ping-Yin Liu | 2017-08-08 |
| 9617143 | Semiconductor device | Chun-Wen Cheng, Jung-Huei Peng, Shang-Ying Tsai, Yi-Chuan Teng | 2017-04-11 |
| 9469524 | Semiconductor device with through molding vias and method of making the same | Chun-Wen Cheng, Jung-Huei Peng, Shang-Ying Tsai, Yi-Chuan Teng | 2016-10-18 |
| 9422153 | Support structure for TSV in MEMS structure | Yi Heng Tsai, Kuei-Sung Chang | 2016-08-23 |
| 9403674 | Methods for packaging a microelectromechanical system (MEMS) wafer and application-specific integrated circuit (ASIC) dies using through mold vias (TMVs) | Chun-Wen Cheng | 2016-08-02 |
| 9352956 | MEMS devices and methods for forming same | Chun-Wen Cheng, Jung-Huei Peng, Shang-Ying Tsai, Yi-Chuan Teng | 2016-05-31 |
| 9315378 | Methods for packaging a microelectromechanical system (MEMS) wafer and application-specific integrated circuit (ASIC) dies using wire bonding | Chun-Wen Cheng | 2016-04-19 |
| 9150404 | Semiconductor device with through molding vias | Chun-Wen Cheng, Jung-Huei Peng, Shang-Ying Tsai, Yi-Chuan Teng | 2015-10-06 |
| 9085456 | Support structure for TSV in MEMS structure | Yi Heng Tsai, Kuei-Sung Chang | 2015-07-21 |
| 8941152 | Semiconductor device | Chun-Wen Cheng, Jung-Huei Peng, Shang-Ying Tsai, Yi-Chuan Teng | 2015-01-27 |