Issued Patents All Time
Showing 1–25 of 35 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12377441 | Hybrid ultrasonic transducer system | Ching-Hui Lin, Yi-Hsien Chang, Chun-Ren Cheng, Fu-Chun Huang, Shih-Fen Huang +2 more | 2025-08-05 |
| 12297105 | Semiconductor structure including scribe line structures and method for fabricating the same | Wei-Cheng Shen, Yi-Hsien Chang, Chun-Ren Cheng | 2025-05-13 |
| 12082505 | Integrated heater (and related method) to recover degraded piezoelectric device performance | Alexander Kalnitsky, Chun-Ren Cheng, Chi-Yuan Shih, Kai-Fung Chang, Shih-Fen Huang +3 more | 2024-09-03 |
| 11984261 | Integration scheme for breakdown voltage enhancement of a piezoelectric metal-insulator-metal device | Anderson Lin, Chun-Ren Cheng, Chi-Yuan Shih, Shih-Fen Huang, Yi-Chuan Teng +6 more | 2024-05-14 |
| 11767219 | Semiconductor structure including scribe line structures and method for fabricating the same | Wei-Cheng Shen, Yi-Hsien Chang, Chun-Ren Cheng | 2023-09-26 |
| 11736037 | MEMS structure and method of forming same | Chia-Hua Chu, Kuei-Sung Chang | 2023-08-22 |
| 11730058 | Integrated heater (and related method) to recover degraded piezoelectric device performance | Alexander Kalnitsky, Chun-Ren Cheng, Chi-Yuan Shih, Kai-Fung Chang, Shih-Fen Huang +3 more | 2023-08-15 |
| 11508902 | Hybrid ultrasonic transducer and method of forming the same | Fu-Chun Huang, Ching-Hui Lin, Chun-Ren Cheng | 2022-11-22 |
| 11289568 | Reduction of electric field enhanced moisture penetration by metal shielding | Chi-Yuan Shih, Kai-Fung Chang, Shih-Fen Huang, Wen-Chuan Tai, Yi-Chuan Teng +9 more | 2022-03-29 |
| 11107630 | Integration scheme for breakdown voltage enhancement of a piezoelectric metal-insulator-metal device | Anderson Lin, Chun-Ren Cheng, Chi-Yuan Shih, Shih-Fen Huang, Yi-Chuan Teng +6 more | 2021-08-31 |
| 10944041 | Hybrid ultrasonic transducer and method of forming the same | Fu-Chun Huang, Ching-Hui Lin, Chun-Ren Cheng | 2021-03-09 |
| 10737936 | Semiconductor structure and method for fabricating the same | Wei-Cheng Shen, Yi-Hsien Chang, Chun-Ren Cheng | 2020-08-11 |
| 10541627 | MEMS structure and method of forming same | Chia-Hua Chu, Kuei-Sung Chang | 2020-01-21 |
| 10087071 | Semiconductor structure and manufacturing method thereof | Tzu-Heng Wu, Chia-Hua Chu, Cheng San Chou, Chen-Hsiung Yang | 2018-10-02 |
| 9975754 | Semiconductor structure and manufacturing method thereof | Fu-Chun Huang, Li-Chen Yen, Tzu-Heng Wu, Chun-Ren Cheng | 2018-05-22 |
| 9859819 | MEMS structure and method of forming same | Chia-Hua Chu, Kuei-Sung Chang | 2018-01-02 |
| 9656855 | Semiconductor structure and manufacturing method thereof | Fu-Chun Huang, Li-Chen Yen, Tzu-Heng Wu, Chun-Ren Cheng | 2017-05-23 |
| 9502370 | Semiconductor bonding structure and process | Kuei-Sung Chang, Nien-Tsung Tsai, Ting-Hau Wu | 2016-11-22 |
| 9493346 | Capacitor with planarized bonding for CMOS-MEMS integration | Wei-Cheng Shen, Yi-Hsien Chang, Tzu-Heng Wu, Chun-Ren Cheng, Chun-Wen Cheng | 2016-11-15 |
| 9446945 | Isolation structure for MEMS 3D IC integration | Yi-Hsien Chang, Chun-Ren Cheng, Chun-Wen Cheng, Tzu-Heng Wu, Wei-Cheng Shen | 2016-09-20 |
| 9449867 | VHF etch barrier for semiconductor integrated microsystem | Tzu-Heng Wu, Yi-Hsien Chang, Kai-Chih Liang, Wei-Cheng Shen, Chun-Ren Cheng +2 more | 2016-09-20 |
| 9422153 | Support structure for TSV in MEMS structure | Kuei-Sung Chang, Hung-Chia Tsai | 2016-08-23 |
| 9418849 | Cavity structure using patterned sacrificial layer | Kuei-Sung Chang | 2016-08-16 |
| 9281287 | Semiconductor bonding structure and process | Kuei-Sung Chang, Nien-Tsung Tsai, Ting-Hau Wu | 2016-03-08 |
| 9266724 | Method for handling a thin substrate and for substrate capping | Kuei-Sung Chang | 2016-02-23 |