Issued Patents All Time
Showing 26–35 of 35 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9085456 | Support structure for TSV in MEMS structure | Kuei-Sung Chang, Hung-Chia Tsai | 2015-07-21 |
| 9065358 | MEMS structure and method of forming same | Chia-Hua Chu, Kuei-Sung Chang | 2015-06-23 |
| 8878312 | Electrical bypass structure for MEMS device | Chia-Ming Hung, Hung-Sen Wang, Hsiang-Fu Chen, Te-Hsi Lee, Alex Kalnitsky +2 more | 2014-11-04 |
| 8878355 | Semiconductor bonding structure and process | Kuei-Sung Chang, Nien-Tsung Tsai, Ting-Hau Wu | 2014-11-04 |
| 8796110 | Method for handling a thin substrate and for substrate capping | Kuei-Sung Chang | 2014-08-05 |
| 8704317 | Microstructure device with an improved anchor | Chung-Hsien Lin, Chun-Wen Cheng, Chia-Hua Chu | 2014-04-22 |
| 8633554 | MEMS device etch stop | Chia-Hua Chu, Kai-Chih Liang, Chia-Pao Shu, Li-Cheng Chu, Kuei-Sung Chang +2 more | 2014-01-21 |
| 8368152 | MEMS device etch stop | Chia-Hua Chu, Kai-Chih Liang, Chia-Pao Shu, Li-Cheng Chu, Kuei-Sung Chang +2 more | 2013-02-05 |
| 8343789 | Microstructure device with an improved anchor | Chung-Hsien Lin, Chun-Wen Cheng, Chia-Hua Chu | 2013-01-01 |
| 8232614 | Package systems having a conductive element through a substrate thereof and manufacturing methods of the same | Chia-Hua Chu, Kuei-Sung Chang, Chung-Hsien Lin, Chia-Ming Hung, Jung-Huei Peng +1 more | 2012-07-31 |