Issued Patents All Time
Showing 1–25 of 32 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11104129 | MEMS devices and methods of fabrication thereof | Jung-Huei Peng, Chun-Ren Cheng, Jiou-Kang Lee, Shang-Ying Tsai | 2021-08-31 |
| 10889493 | MEMS method and structure | Kuei-Sung Chang | 2021-01-12 |
| 10688786 | MEMS devices and methods of fabrication thereof | Jung-Huei Peng, Chun-Ren Cheng, Jiou-Kang Lee, Shang-Ying Tsai | 2020-06-23 |
| 10160642 | MEMS method and structure | Kuei-Sung Chang | 2018-12-25 |
| 10023459 | MEMS and method for forming the same | Kuei-Sung Chang | 2018-07-17 |
| 9950522 | MEMS devices and methods of fabrication thereof | Jung-Huei Peng, Chun-Ren Cheng, Jiou-Kang Lee, Shang-Ying Tsai | 2018-04-24 |
| 9677884 | Methods of forming a gyroscope sensor and a structure for a gyroscope sensors | Chun-Ren Cheng, Jiou-Kang Lee, Jung-Huei Peng, Shang-Ying Tsai | 2017-06-13 |
| 9502370 | Semiconductor bonding structure and process | Kuei-Sung Chang, Nien-Tsung Tsai, Yi Heng Tsai | 2016-11-22 |
| 9394164 | MEMS method and structure | Kuei-Sung Chang | 2016-07-19 |
| 9321632 | Socket type MEMS bonding | — | 2016-04-26 |
| 9281287 | Semiconductor bonding structure and process | Kuei-Sung Chang, Nien-Tsung Tsai, Yi Heng Tsai | 2016-03-08 |
| 9238581 | Triple-axis MEMS accelerometer | Chun-Ren Cheng, Shang-Ying Tsai, Jiou-Kang Lee, Jung-Huei Peng | 2016-01-19 |
| 9156685 | Method for the prevention of suspended silicon structure etching during reactive ion etching | Kuei-Sung Chang | 2015-10-13 |
| 9138994 | MEMS devices and methods of fabrication thereof | Jung-Huei Peng, Chun-Ren Cheng, Jiou-Kang Lee, Shang-Ying Tsai | 2015-09-22 |
| 8987845 | Method for the prevention of suspended silicon structure etching during reactive ion etching | Kuei-Sung Chang | 2015-03-24 |
| 8878355 | Semiconductor bonding structure and process | Kuei-Sung Chang, Nien-Tsung Tsai, Yi Heng Tsai | 2014-11-04 |
| 8776600 | Gyroscope sensors | Chun-Ren Cheng, Jiou-Kang Lee, Jung-Huei Peng, Shang-Ying Tsai | 2014-07-15 |
| 8563400 | Laser bonding for stacking semiconductor substrates | Chun-Ren Cheng, Jiou-Kang Lee, Shang-Ying Tsai, Jung-Huei Peng | 2013-10-22 |
| 8455999 | Method for reducing chip warpage | Chun-Ren Cheng, Jiou-Kang Lee, Shang-Ying Tsai, Jung-Huei Peng | 2013-06-04 |
| 8367516 | Laser bonding for stacking semiconductor substrates | Chun-Ren Cheng, Jiou-Kang Lee, Shang-Ying Tsai, Jung-Huei Peng | 2013-02-05 |
| 8362578 | Triple-axis MEMS accelerometer | Chun-Ren Cheng, Shang-Ying Tsai, Jiou-Kang Lee, Jung-Huei Peng | 2013-01-29 |
| 8309441 | Process for eliminating delamination between amorphous silicon layers | Jiou-Kang Lee, Chun-Ren Cheng, Shang-Ying Tsai, Hsiang-Fu Chen | 2012-11-13 |
| 8281658 | Method to produce 3-D optical gyroscope my MEMS technology | Chun-Ren Cheng, Jiou-Kang Lee, Jung-Huei Peng, Shang-Ying Tsai | 2012-10-09 |
| 8237263 | Method and apparatus for cooling an integrated circuit | Chun-Ren Cheng, Chun-Wen Cheng, Jiou-Kang Lee, Jung-Huei Peng, Shang-Ying Tsai +1 more | 2012-08-07 |
| 8237235 | Metal-ceramic multilayer structure | Chun-Ren Cheng, Shang-Ying Tsai, Jung-Huei Peng, Jiou-Kang Lee | 2012-08-07 |