Issued Patents All Time
Showing 1–25 of 37 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11186481 | Sensor device and manufacturing method thereof | Chen-Hsiung Yang, Chun-Wen Cheng | 2021-11-30 |
| 11180365 | MEMS devices and methods of forming same | Kai-Chih Liang, Chia-Hua Chu, Te-Hao Lee, Chung-Hsien Lin | 2021-11-23 |
| 11104129 | MEMS devices and methods of fabrication thereof | Jung-Huei Peng, Chun-Ren Cheng, Shang-Ying Tsai, Ting-Hau Wu | 2021-08-31 |
| 10688786 | MEMS devices and methods of fabrication thereof | Jung-Huei Peng, Chun-Ren Cheng, Shang-Ying Tsai, Ting-Hau Wu | 2020-06-23 |
| 10457550 | MEMS devices and methods of forming same | Kai-Chih Liang, Chia-Hua Chu, Te-Hao Lee, Chung-Hsien Lin | 2019-10-29 |
| 10266399 | Apparatus and method of manufacturing for combo MEMS device accommodating different working pressures | Wen-Chuan Tai | 2019-04-23 |
| 10099919 | MEMS devices and methods of forming same | Kai-Chih Liang, Chia-Hua Chu, Te-Hao Lee, Chung-Hsien Lin | 2018-10-16 |
| 9950522 | MEMS devices and methods of fabrication thereof | Jung-Huei Peng, Chun-Ren Cheng, Shang-Ying Tsai, Ting-Hau Wu | 2018-04-24 |
| 9725299 | MEMS device and multi-layered structure | Chun-Wen Cheng | 2017-08-08 |
| 9677884 | Methods of forming a gyroscope sensor and a structure for a gyroscope sensors | Ting-Hau Wu, Chun-Ren Cheng, Jung-Huei Peng, Shang-Ying Tsai | 2017-06-13 |
| 9617147 | Dual layer microelectromechanical systems device and method of manufacturing same | Chia-Hua Chu, Chun-Wen Cheng, Kai-Chih Liang, Chung-Hsien Lin, Te-Hao Lee | 2017-04-11 |
| 9604840 | MEMS device | Chun-Wen Cheng | 2017-03-28 |
| 9499396 | MEMS devices and methods of forming same | Kai-Chih Liang, Chia-Hua Chu, Te-Hao Lee, Chung-Hsien Lin | 2016-11-22 |
| 9422151 | Semiconductor device and manufacturing method thereof | Wen-Chuan Tai, Alexander Kalnitsky, Hsin-Ting Huang, Hsiang-Fu Chen, Ching-Kai Shen | 2016-08-23 |
| 9238581 | Triple-axis MEMS accelerometer | Ting-Hau Wu, Chun-Ren Cheng, Shang-Ying Tsai, Jung-Huei Peng | 2016-01-19 |
| 9138994 | MEMS devices and methods of fabrication thereof | Jung-Huei Peng, Chun-Ren Cheng, Shang-Ying Tsai, Ting-Hau Wu | 2015-09-22 |
| 9133017 | MEMS structure with adaptable inter-substrate bond | Kai-Chih Liang, Chung-Hsien Lin, Te-Hao Lee, Chia-Hua Chu | 2015-09-15 |
| 9006015 | Dual layer microelectromechanical systems device and method of manufacturing same | Chia-Hua Chu, Te-Hao Lee, Kai-Chih Liang, Chung-Hsien Lin, Chun-Wen Cheng | 2015-04-14 |
| 8987059 | MEMS devices and methods of forming same | Kai-Chih Liang, Chia-Hua Chu, Te-Hao Lee, Chung-Hsien Lin | 2015-03-24 |
| 8776600 | Gyroscope sensors | Ting-Hau Wu, Chun-Ren Cheng, Jung-Huei Peng, Shang-Ying Tsai | 2014-07-15 |
| 8748205 | MEMS structure with adaptable inter-substrate bond | Kai-Chih Liang, Chung-Hsien Lin, Te-Hao Lee, Chia-Hua Chu | 2014-06-10 |
| 8563400 | Laser bonding for stacking semiconductor substrates | Ting-Hau Wu, Chun-Ren Cheng, Shang-Ying Tsai, Jung-Huei Peng | 2013-10-22 |
| 8455999 | Method for reducing chip warpage | Ting-Hau Wu, Chun-Ren Cheng, Shang-Ying Tsai, Jung-Huei Peng | 2013-06-04 |
| 8367516 | Laser bonding for stacking semiconductor substrates | Ting-Hau Wu, Chun-Ren Cheng, Shang-Ying Tsai, Jung-Huei Peng | 2013-02-05 |
| 8362578 | Triple-axis MEMS accelerometer | Ting-Hau Wu, Chun-Ren Cheng, Shang-Ying Tsai, Jung-Huei Peng | 2013-01-29 |