Issued Patents All Time
Showing 1–25 of 25 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12274172 | Piezoelectric actuating apparatus | Hao-Chien Cheng, Wei-Leun Fang, Ming-Ching Wu | 2025-04-08 |
| 12170214 | Semiconductor device manufacturing system and method for manufacturing semiconductor device | Yu-Kai Chen | 2024-12-17 |
| 11486854 | CMOS compatible BioFET | Alexander Kalnitsky, Yi-Shao Liu, Chia-Hua Chu, Chun-Ren Cheng, Chun-Wen Cheng | 2022-11-01 |
| 11180365 | MEMS devices and methods of forming same | Chia-Hua Chu, Te-Hao Lee, Jiou-Kang Lee, Chung-Hsien Lin | 2021-11-23 |
| 10520467 | CMOS compatible BioFET | Alexander Kalnitsky, Yi-Shao Liu, Chia-Hua Chu, Chun-Ren Cheng, Chun-Wen Cheng | 2019-12-31 |
| 10457550 | MEMS devices and methods of forming same | Chia-Hua Chu, Te-Hao Lee, Jiou-Kang Lee, Chung-Hsien Lin | 2019-10-29 |
| 10099919 | MEMS devices and methods of forming same | Chia-Hua Chu, Te-Hao Lee, Jiou-Kang Lee, Chung-Hsien Lin | 2018-10-16 |
| 9910009 | CMOS compatible BioFET | Alexander Kalnitsky, Yi-Shao Liu, Chia-Hua Chu, Chun-Ren Cheng, Chun-Wen Cheng | 2018-03-06 |
| 9791406 | CMOS compatible BioFET | Alexander Kalnitsky, Yi-Shao Liu, Chia-Hua Chu, Chun-Ren Cheng, Chun-Wen Cheng | 2017-10-17 |
| 9617147 | Dual layer microelectromechanical systems device and method of manufacturing same | Chia-Hua Chu, Chun-Wen Cheng, Jiou-Kang Lee, Chung-Hsien Lin, Te-Hao Lee | 2017-04-11 |
| 9499396 | MEMS devices and methods of forming same | Chia-Hua Chu, Te-Hao Lee, Jiou-Kang Lee, Chung-Hsien Lin | 2016-11-22 |
| 9459234 | CMOS compatible BioFET | Alexander Kalnitsky, Yi-Shao Liu, Chia-Hua Chu, Chun-Ren Cheng, Chun-Wen Cheng | 2016-10-04 |
| 9449867 | VHF etch barrier for semiconductor integrated microsystem | Tzu-Heng Wu, Yi-Hsien Chang, Yi Heng Tsai, Wei-Cheng Shen, Chun-Ren Cheng +2 more | 2016-09-20 |
| 9359194 | MEMS devices, packaged MEMS devices, and methods of manufacture thereof | Chun-Wen Cheng | 2016-06-07 |
| 9254997 | CMOS-MEMS integrated flow for making a pressure sensitive transducer | Chun-Wen Cheng, Chia-Hua Chu | 2016-02-09 |
| 9133017 | MEMS structure with adaptable inter-substrate bond | Jiou-Kang Lee, Chung-Hsien Lin, Te-Hao Lee, Chia-Hua Chu | 2015-09-15 |
| 9006015 | Dual layer microelectromechanical systems device and method of manufacturing same | Chia-Hua Chu, Te-Hao Lee, Jiou-Kang Lee, Chung-Hsien Lin, Chun-Wen Cheng | 2015-04-14 |
| 8987059 | MEMS devices and methods of forming same | Chia-Hua Chu, Te-Hao Lee, Jiou-Kang Lee, Chung-Hsien Lin | 2015-03-24 |
| 8952465 | MEMS devices, packaged MEMS devices, and methods of manufacture thereof | Chun-Wen Cheng | 2015-02-10 |
| 8748205 | MEMS structure with adaptable inter-substrate bond | Jiou-Kang Lee, Chung-Hsien Lin, Te-Hao Lee, Chia-Hua Chu | 2014-06-10 |
| 8647892 | Inline process control structures | Wen-Chuan Tai, Chun-Ren Cheng | 2014-02-11 |
| 8633554 | MEMS device etch stop | Chia-Hua Chu, Yi Heng Tsai, Chia-Pao Shu, Li-Cheng Chu, Kuei-Sung Chang +2 more | 2014-01-21 |
| 8368152 | MEMS device etch stop | Chia-Hua Chu, Yi Heng Tsai, Chia-Pao Shu, Li-Cheng Chu, Kuei-Sung Chang +2 more | 2013-02-05 |
| 8012785 | Method of fabricating an integrated CMOS-MEMS device | Hua-Shu Wu, Li Peng, Tsung-Cheng Huang, Mingo Liu, Nick Y. M. Shen +1 more | 2011-09-06 |
| 7732299 | Process for wafer bonding | Fa-Yuan Chang, Tsung-Mu Lai, Hua-Shu Wu, Chin-Hsiang Ho, Gwo-Yuh Shiau +6 more | 2010-06-08 |