Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8084361 | Semiconductor fabrication method suitable for MEMS | Tsung-Cheng Huang, Hua-Shu Wu, I-Ching Lin, Hsi-Lung Lee, Yuan-Hao Chien | 2011-12-27 |
| 7732299 | Process for wafer bonding | Tsung-Mu Lai, Kai-Chih Liang, Hua-Shu Wu, Chin-Hsiang Ho, Gwo-Yuh Shiau +6 more | 2010-06-08 |
| 7696766 | Ultra-fine pitch probe card structure | Hsu Ming Cheng, Clinton Chao, Hua-Shu Wu | 2010-04-13 |
| 6679064 | Wafer transfer system with temperature control apparatus | Chih-Wei Chang, Cheng-Ting Tseng, Chin-Chang Chen, Cheng-Cheng Chang, Shih-Fang Chen | 2004-01-20 |
| 6069091 | In-situ sequential silicon containing hard mask layer/silicon layer plasma etch method | Ming-Yeon Hung | 2000-05-30 |