Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9236311 | Controlling the device performance by forming a stressed backside dielectric layer | Ming-Fa Chen | 2016-01-12 |
| 8946084 | Controlling the device performance by forming a stressed backside dielectric layer | Ming-Fa Chen | 2015-02-03 |
| 8546886 | Controlling the device performance by forming a stressed backside dielectric layer | Ming-Fa Chen | 2013-10-01 |
| 8222139 | Chemical mechanical polishing (CMP) processing of through-silicon via (TSV) and contact plug simultaneously | Ming-Fa Chen | 2012-07-17 |
| 8084361 | Semiconductor fabrication method suitable for MEMS | Tsung-Cheng Huang, Hua-Shu Wu, Fa-Yuan Chang, Hsi-Lung Lee, Yuan-Hao Chien | 2011-12-27 |