HW

Hua-Shu Wu

TSMC: 25 patents #1,360 of 12,232Top 15%
MI Miradia: 2 patents #16 of 30Top 55%
UM United Microelectronics: 2 patents #1,942 of 4,560Top 45%
MC Miramems Sensing Technology Co.: 1 patents #5 of 7Top 75%
Overall (All Time): #124,263 of 4,157,543Top 3%
30
Patents All Time

Issued Patents All Time

Showing 1–25 of 30 patents

Patent #TitleCo-InventorsDate
10961118 Wafer level integrated MEMS device enabled by silicon pillar and smart cap Yi-Chia Lee, Chin-Min Lin, Cheng San Chou, Hsiang-Fu Chen, Wen-Chuan Tai +2 more 2021-03-30
10899608 Wafer level integrated MEMS device enabled by silicon pillar and smart cap Yi-Chia Lee, Chin-Min Lin, Cheng San Chou, Hsiang-Fu Chen, Wen-Chuan Tai +2 more 2021-01-26
10556792 Wafer level integrated MEMS device enabled by silicon pillar and smart cap Yi-Chia Lee, Chin-Min Lin, Cheng San Chou, Hsiang-Fu Chen, Wen-Chuan Tai +2 more 2020-02-11
10040681 Method and system for MEMS devices Yu-Hao Chien, Shih-Yung Chung, Li-Tien Tseng, Yu-Te Yeh 2018-08-07
9278853 Manufacturing process of MEMS device Yu-Hao Chien, Shih-Yung Chung, Li-Tien Tseng, Yu-Te Yeh 2016-03-08
8754529 MEMS device with simplified electrical conducting paths Yu-Hao Chien, Shih-Yung Chung, Li-Tien Tseng, Yu-Te Yeh 2014-06-17
8278724 Methods of fabricating a micromechanical structure Chia-Hua Chang, Tsung-Mu Lai 2012-10-02
8119992 System for overlay measurement in semiconductor manufacturing Hsiao-Tzu Lu, Chin-Hsiang Lin, Chia-Hsiang Lin, Kuei-Shun Chen 2012-02-21
8084361 Semiconductor fabrication method suitable for MEMS Tsung-Cheng Huang, Fa-Yuan Chang, I-Ching Lin, Hsi-Lung Lee, Yuan-Hao Chien 2011-12-27
8049323 Chip holder with wafer level redistribution layer Chen-Shien Chen, Chao-Hsiang Yang, Jimmy Liang, Han-Liang Tseng, Mirng-Ji Lii +1 more 2011-11-01
8012785 Method of fabricating an integrated CMOS-MEMS device Kai-Chih Liang, Li Peng, Tsung-Cheng Huang, Mingo Liu, Nick Y. M. Shen +1 more 2011-09-06
7851331 Bonding structures and methods of forming bonding structures Szu-Wei Lu, Mirng-Ji Lii, Chen-Shien Chen, Jerry Tzou 2010-12-14
7732299 Process for wafer bonding Fa-Yuan Chang, Tsung-Mu Lai, Kai-Chih Liang, Chin-Hsiang Ho, Gwo-Yuh Shiau +6 more 2010-06-08
7728396 Semiconductor structures Tsung-Mu Lai, Ming-Chih Chang, Che-Rong Laing 2010-06-01
7696766 Ultra-fine pitch probe card structure Hsu Ming Cheng, Clinton Chao, Fa-Yuan Chang 2010-04-13
7582538 Method of overlay measurement for alignment of patterns in semiconductor manufacturing Hsiao-Tzu Lu, Chin-Hsiang Lin, Chia-Hsiang Lin, Kuei-Shun Chen 2009-09-01
7468327 Methods of fabricating a micromechanical structure Chia-Hua Chang, Tsung-Mu Lai 2008-12-23
7459344 Method for forming micromachined structure Chia-Hua Chang 2008-12-02
7453127 Double-diffused-drain MOS device with floating non-insulator spacers Feng-Chi Hung, Hung-Lin Chen, Shih-Chin Lee 2008-11-18
7295374 Micro-lens and micro-lens fabrication method Ming-Chih Chang, Tsung-Mu Lai 2007-11-13
7255425 Ink-channel wafer integrated with CMOS wafer for inkjet printhead and fabrication method thereof Tsung-Mu Lai, Ming-Chih Chang 2007-08-14
7198975 Semiconductor methods and structures Tsung-Mu Lai, Ming-Chih Chang, Che-Rong Laing 2007-04-03
7094711 Micro pipe manufacturing method Ming-Chih Chang, Tsong-Mu Lai 2006-08-22
7011933 Method for manufacturing micro-optical mirror arrays Ming-Chih Chang, Tsong-Mu Lai 2006-03-14
6875689 Method of patterning lines in semiconductor devices 2005-04-05