Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8704383 | Silicon-based thin substrate and packaging schemes | Szu-Wei Lu, Clinton Chao, Ann Luh, Tjandra Winata Karta, Kuo-Chin Chang | 2014-04-22 |
| 8174129 | Silicon-based thin substrate and packaging schemes | Szu-Wei Lu, Clinton Chao, Ann Luh, Tjandra Winata Karta, Kuo-Chin Chang | 2012-05-08 |
| 7851331 | Bonding structures and methods of forming bonding structures | Szu-Wei Lu, Mirng-Ji Lii, Chen-Shien Chen, Hua-Shu Wu | 2010-12-14 |
| 7804177 | Silicon-based thin substrate and packaging schemes | Szu-Wei Lu, Clinton Chao, Ann Luh, Tjandra Winata Karta, Kuo-Chin Chang | 2010-09-28 |
| 7446424 | Interconnect structure for semiconductor package | Szu-Wei Lu | 2008-11-04 |