Issued Patents All Time
Showing 1–25 of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9356108 | Dummy structure for multiple gate dielectric interface and methods | Huei-Ru Liou, Chien-Chih Chou, Kong-Beng Thei | 2016-05-31 |
| 8847319 | Dummy structure for multiple gate dielectric interface and methods | Huei-Ru Liu, Chien-Chih Chou, Kong-Beng Thei | 2014-09-30 |
| 8710560 | Embedded bonding pad for image sensors | Yuan-Chih Hsieh, Shih-Chang Liu, Shih-Chi Fu, Tzu-Hsuan Hsu, Chung-Yi Yu +1 more | 2014-04-29 |
| RE44376 | Silicon substrate with reduced surface roughness | Ming Chyi Liu, Tzu-Hsuan Hsu, Chia-Shiung Tsai | 2013-07-16 |
| 8357561 | Method of fabricating backside illuminated image sensor | Shih-Chi Fu, Liang-Lung Yao, Yuan-Chih Hsieh, Feng-Jia Shiu | 2013-01-22 |
| 8053853 | Color filter-embedded MSM image sensor | Jiunn-Yih Chyan, Chia-Shiung Tsai | 2011-11-08 |
| 8048807 | Method and apparatus for thinning a substrate | Ming Chyi Liu, Yao Fei Chuang, Martin Liu, Chia-Shiung Tsai | 2011-11-01 |
| 7923344 | Method of fabricating backside illuminated image sensor | Shih-Chi Fu, Liang-Lung Yao, Yuan-Chih Hsieh, Feng-Jia Shiu | 2011-04-12 |
| 7883917 | Semiconductor device with bonding pad | Ming Chyi Liu, Yuan-Hung Liu, Yuan-Chih Hsieh, Chi-Hsin Lo, Chia-Shiung Tsai | 2011-02-08 |
| 7883926 | Methods for fabricating image sensor devices | Ming Chyi Liu, Yuan-Chih Hsieh, Shih-Chi Fu, Chia-Shiung Tsai | 2011-02-08 |
| 7863067 | Silicon substrate with reduced surface roughness | Ming Chyi Liu, Tzu-Hsuan Hsu, Chia-Shiung Tsai | 2011-01-04 |
| RE41697 | Method of forming planarized coatings on contact hole patterns of various duty ratios | Chia-Tung Ho, Feng-Jia Shih, Jieh-Jang Chen, Ching-Sen Kuo, Shih-Chi Fu +1 more | 2010-09-14 |
| 7732299 | Process for wafer bonding | Fa-Yuan Chang, Tsung-Mu Lai, Kai-Chih Liang, Hua-Shu Wu, Chin-Hsiang Ho +6 more | 2010-06-08 |
| 7709872 | Methods for fabricating image sensor devices | Ming Chyi Liu, Yuan-Chih Hsieh, Shih-Chi Fu, Chia-Shiung Tsai | 2010-05-04 |
| 7659595 | Embedded bonding pad for backside illuminated image sensor | Chia-Shiung Tsai | 2010-02-09 |
| 7648851 | Method of fabricating backside illuminated image sensor | Shih-Chu Fu, Liang-Lung Yao, Yuan-Chih Hsieh, Feng-Jia Shiu | 2010-01-19 |
| 7443005 | Lens structures suitable for use in image sensors and method for making the same | Ching-Sen Kuo, Feng-Jia Shiu, Jieh-Jang Chen, Shih-Chi Fu, Chien-Hsien Tseng +5 more | 2008-10-28 |
| 7144773 | Method for preventing trenching in fabricating split gate flash devices | Shih-Chang Liu, Chi-Hsin Lo, Chia-Shiung Tsai | 2006-12-05 |
| 6803291 | Method to preserve alignment mark optical integrity | Shih-Chi Fu, Feng-Jia Shih, Chia-Tung Ho, Chih-Ta Wu, Ching-Sen Kuo +2 more | 2004-10-12 |
| 6645851 | Method of forming planarized coatings on contact hole patterns of various duty ratios | Chia-Tung Ho, Feng-Jia Shih, Jieh-Jang Chen, Ching-Sen Kuo, Shih-Chi Fu +1 more | 2003-11-11 |
| 6632590 | Enhance the process window of memory cell line/space dense pattern in sub-wavelength process | San-De Tzu, Tsung-Hou Lee, Chih-Hsiung Lee, Ching-Sen Kuo | 2003-10-14 |
| 6077756 | Overlay target pattern and algorithm for layer-to-layer overlay metrology for semiconductor processing | Hua-Tai Lin, Pin-Ting Wang | 2000-06-20 |
| 5985363 | Method of providing uniform photoresist coatings for tight control of image dimensions | Shinn-Jhy Lian, Daniel Lee, Li-Ming Wang, Hsiang-Wei Tseng | 1999-11-16 |
| 5982044 | Alignment pattern and algorithm for photolithographic alignment marks on semiconductor substrates | Hua-Tai Lin, Pin-Ting Wang | 1999-11-09 |
| 5677001 | Striation-free coating method for high viscosity resist coating | Li-Ming Wang | 1997-10-14 |