Issued Patents All Time
Showing 1–25 of 498 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12408354 | Method to reduce breakdown failure in a MIM capacitor | Hsing-Lien Lin, Chii-Ming Wu, Chung-Yi Yu, Rei-Lin Chu | 2025-09-02 |
| 12369352 | Thin film transfer using substrate with etch stop layer and diffusion barrier layer | Eugene Chen, Ru-Liang Lee, Chen-Hao Chiang | 2025-07-22 |
| 12360314 | Photonic semiconductor-on-insulator (SOI) substrate and method for forming the photonic SOI substrate | Eugene Chen, Kuan-Liang Liu, De-Yang Chiou, Yung-Lung Lin | 2025-07-15 |
| 12336201 | Capacitor structure and method of making the same | Jian-Shiou Huang, Cheng-Yuan Tsai, Hsing-Lien Lin, Yao-Wen Chang | 2025-06-17 |
| 12336229 | Split gate memory device and method of fabricating the same | Chang-Ming Wu, Wei-Cheng Wu, Shih-Chang Liu, Harry-Hak-Lay Chuang | 2025-06-17 |
| 12334389 | Manufacturing method of semiconductor device | Chi-Ming Chen, Kuei-Ming Chen, Po-Chun Liu, Chung-Yi Yu | 2025-06-17 |
| 12324156 | Memory devices and method of fabricating same | Chang-Ming Wu, Wei-Cheng Wu, Shih-Chang Liu, Harry-Hak-Lay Chuang | 2025-06-03 |
| 12289979 | Deposition system for high accuracy patterning | Ping-Yin Liu, Xin-Hua Huang, Yu-Hsing Chang, Yeong-Jyh Lin | 2025-04-29 |
| 12278139 | Manufacturing method of semiconductor device | Chi-Ming Chen, Kuei-Ming Chen, Po-Chun Liu, Chung-Yi Yu | 2025-04-15 |
| 12255062 | Integrate rinse module in hybrid bonding platform | Xin-Hua Huang, Ping-Yin Liu, Hung-Hua Lin, Hsun-Chung Kuang, Yuan-Chih Hsieh +2 more | 2025-03-18 |
| 12213323 | Embedded backside memory on a field effect transistor | Kuan-Liang Liu, Sheng-Chau Chen, Chung-Liang Cheng, Yeong-Jyh Lin, Pinyen Lin +1 more | 2025-01-28 |
| 12165911 | Method for forming a semiconductor-on-insulator (SOI) substrate | Cheng-Ta Wu, Jiech-Fun Lu, Kuan-Liang Liu, Shih Pei Chou, Yu-Hung Cheng +1 more | 2024-12-10 |
| 12113071 | Multi-function substrate | Eugene Chen, Kuan-Liang Liu, Szu-Yu Wang, Ru-Liang Lee, Chih-Ping Chao +1 more | 2024-10-08 |
| 12021066 | Buffer layer(s) on a stacked structure having a via | Chen-Fa Lu, Cheng-Yuan Tsai, Yeur-Luen Tu | 2024-06-25 |
| 12002813 | Method for forming semiconductor-on-insulator (SOI) substrate by cleaving a multilayer structure along voids to separate a substrate | Yu-Hung Cheng, Ching-I Li | 2024-06-04 |
| 11955374 | Method for forming SOI substrate | Chi-Ming Chen, Eugene Chen | 2024-04-09 |
| 11925033 | Embedded backside memory on a field effect transistor | Kuan-Liang Liu, Sheng-Chau Chen, Chung-Liang Cheng, Yeong-Jyh Lin, Pinyen Lin +1 more | 2024-03-05 |
| 11923237 | Manufacturing method of semiconductor device | Chi-Ming Chen, Kuei-Ming Chen, Po-Chun Liu, Chung-Yi Yu | 2024-03-05 |
| 11894408 | Dual facing BSI image sensors with wafer level stacking | Ping-Yin Liu, Yeur-Luen Tu, Xiaomeng Chen, Pin-Nan Tseng | 2024-02-06 |
| 11856750 | Semiconductor arrangement with capacitor | Chern-Yow Hsu, Chen-Jong Wang, Shih-Chang Liu, Xiaomeng Chen | 2023-12-26 |
| 11854795 | Integrate rinse module in hybrid bonding platform | Xin-Hua Huang, Ping-Yin Liu, Hung-Hua Lin, Hsun-Chung Kuang, Yuan-Chih Hsieh +2 more | 2023-12-26 |
| 11855159 | Method for forming thin semiconductor-on-insulator (SOI) substrates | Cheng-Ta Wu, Jiech-Fun Lu, Kuo-Hwa Tzeng, Shih Pei Chou, Yu-Hung Cheng +1 more | 2023-12-26 |
| 11830764 | Method for forming a semiconductor-on-insulator (SOI) substrate | Cheng-Ta Wu, Jiech-Fun Lu, Kuan-Liang Liu, Shih Pei Chou, Yu-Hung Cheng +1 more | 2023-11-28 |
| 11818944 | Deposition system for high accuracy patterning | Ping-Yin Liu, Xin-Hua Huang, Yu-Hsing Chang, Yeong-Jyh Lin | 2023-11-14 |
| 11804531 | Thin film transfer using substrate with etch stop layer and diffusion barrier layer | Eugene Chen, Ru-Liang Lee, Chen-Hao Chiang | 2023-10-31 |