PL

Ping-Yin Liu

TSMC: 97 patents #274 of 12,232Top 3%
UN Unknown: 4 patents #4,220 of 83,584Top 6%
IBM: 4 patents #21,733 of 70,183Top 35%
BI Bonutti Ip: 2 patents #2 of 6Top 35%
IT ITRI: 2 patents #3,461 of 9,619Top 40%
PC P-Tech Co.: 1 patents #13 of 18Top 75%
UM United Microelectronics: 1 patents #2,686 of 4,560Top 60%
JU Jiangnan University: 1 patents #442 of 1,321Top 35%
HP HP: 1 patents #8,774 of 16,619Top 55%
📍 Longbeilingcun, IL: #1 of 30 inventorsTop 4%
Overall (All Time): #9,062 of 4,157,543Top 1%
125
Patents All Time

Issued Patents All Time

Showing 1–25 of 125 patents

Patent #TitleCo-InventorsDate
D1088944 Ring cover 2025-08-19
D1083657 Ring cover 2025-07-15
D1073527 Ring cover 2025-05-06
12289979 Deposition system for high accuracy patterning Chia-Shiung Tsai, Xin-Hua Huang, Yu-Hsing Chang, Yeong-Jyh Lin 2025-04-29
12255062 Integrate rinse module in hybrid bonding platform Xin-Hua Huang, Hung-Hua Lin, Hsun-Chung Kuang, Yuan-Chih Hsieh, Lan-Lin Chao +2 more 2025-03-18
D1064801 Magnetic hook 2025-03-04
D1061309 Ring cover 2025-02-11
12211727 Simultaneous bonding approach for high quality wafer stacking Xin-Hua Huang, Chang-Chen Tsao 2025-01-28
11947560 Processing a federated query via data serialization Lei Cui 2024-04-02
11932534 MEMS device having a metallization structure embedded in a dielectric structure with laterally offset sidewalls of a first portion and a second portion Hung-Hua Lin, Chang-Ming Wu, Chung-Yi Yu, Jung-Huei Peng 2024-03-19
11894408 Dual facing BSI image sensors with wafer level stacking Yeur-Luen Tu, Chia-Shiung Tsai, Xiaomeng Chen, Pin-Nan Tseng 2024-02-06
11854999 Patterning a transparent wafer to form an alignment mark in the transparent wafer Xin-Hua Huang 2023-12-26
11854795 Integrate rinse module in hybrid bonding platform Xin-Hua Huang, Hung-Hua Lin, Hsun-Chung Kuang, Yuan-Chih Hsieh, Lan-Lin Chao +2 more 2023-12-26
11818944 Deposition system for high accuracy patterning Chia-Shiung Tsai, Xin-Hua Huang, Yu-Hsing Chang, Yeong-Jyh Lin 2023-11-14
11742321 Apparatus for bond wave propagation control Xin-Hua Huang, Kuan-Liang Liu, Kuo-Liang Lu 2023-08-29
11721637 Patterning a transparent wafer to form an alignment mark in the transparent wafer Xin-Hua Huang 2023-08-08
11621186 Simultaneous bonding approach for high quality wafer stacking applications Xin-Hua Huang, Chang-Chen Tsao 2023-04-04
D974886 Magnetic hook 2023-01-10
11550812 Processing a federated query via data serialization Lei Cui 2023-01-10
11508562 Low contamination chamber for surface activation Xin-Hua Huang, Lee-Chuan Tseng, Lan-Lin Chao 2022-11-22
D966872 Magnetic hook 2022-10-18
11354312 Access-plan-based querying for federated database-management systems Chang Sheng Liu, Yan Xu, Hui Guo, Yao M. Wang, Hai Jun Shen 2022-06-07
11279615 Method for manufacturing a MEMS device by first hybrid bonding a CMOS wafer to a MEMS wafer Hung-Hua Lin, Chang-Ming Wu, Chung-Yi Yu, Jung-Huei Peng 2022-03-22
11282697 Integrate rinse module in hybrid bonding platform Xin-Hua Huang, Hung-Hua Lin, Hsun-Chung Kuang, Yuan-Chih Hsieh, Lan-Lin Chao +2 more 2022-03-22
11243961 Complex query optimization Ya Qiong Liu, Xue Gang Huang, Lei Cui, Ying Qi Pan 2022-02-08