Issued Patents All Time
Showing 26–50 of 125 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11189515 | Method for alignment, process tool and method for wafer-level alignment | Ching-Hung Wang, Yeong-Jyh Lin, Yeur-Luen Tu | 2021-11-30 |
| 11168682 | Method to determine the reasonable design area of rotor profile of roots pump and its application | Xueming HE, Hainan Huang, Zhenchao Liu, Jiachuan YU | 2021-11-09 |
| 11127725 | Semiconductor structure and associated manufacturing method | Yeong-Jyh Lin, Chi-Ming Chen | 2021-09-21 |
| 11094575 | Simultaneous bonding approach for high quality wafer stacking applications | Xin-Hua Huang, Chang-Chen Tsao | 2021-08-17 |
| 11037978 | Dual facing BSI image sensors with wafer level stacking | Yeur-Luen Tu, Chia-Shiung Tsai, Xiaomeng Chen, Pin-Nan Tseng | 2021-06-15 |
| 11031369 | Apparatus for bond wave propagation control | Xin-Hua Huang, Kuan-Liang Liu, Kuo-Liang Lu | 2021-06-08 |
| 11014805 | Method of forming semiconductor package and semiconductor package | Chun-Wen Cheng, Hung-Chia Tsai, Lan-Lin Chao, Yuan-Chih Hsieh | 2021-05-25 |
| 10962878 | Approach for ultra thin-film transfer and handling | Chang-Ming Wu, Chia-Shiung Tsai, Xin-Hua Huang | 2021-03-30 |
| 10790189 | 3D integrated circuit and methods of forming the same | Hsun-Chung Kuang, Yen-Chang Chu, Cheng-Tai Hsiao, Lan-Lin Chao, Yeur-Luen Tu +2 more | 2020-09-29 |
| 10781098 | Method of manufacturing semiconductor structure | Hung-Hua Lin, Kuan-Liang Liu, Chia-Shiung Tsai, Alexander Kalnitsky | 2020-09-22 |
| 10665449 | Integrate rinse module in hybrid bonding platform | Xin-Hua Huang, Hung-Hua Lin, Hsun-Chung Kuang, Yuan-Chih Hsieh, Lan-Lin Chao +2 more | 2020-05-26 |
| 10636688 | Method for alignment, process tool and method for wafer-level alignment | Ching-Hung Wang, Yeong-Jyh Lin, Yeur-Luen Tu | 2020-04-28 |
| 10622342 | Stacked LED structure and associated manufacturing method | Yeong-Jyh Lin, Chi-Ming Chen | 2020-04-14 |
| 10510597 | Methods for hybrid wafer bonding integrated with CMOS processing | Pin-Nan Tseng, Chia-Shiung Tsai | 2019-12-17 |
| 10509312 | Approach for ultra thin-film transfer and handling | Chang-Ming Wu, Chia-Shiung Tsai, Xin-Hua Huang | 2019-12-17 |
| 10497667 | Apparatus for bond wave propagation control | Xin-Hua Huang, Kuan-Liang Liu, Kuo-Liang Lu | 2019-12-03 |
| 10453889 | Dual facing BSI image sensors with wafer level stacking | Yeur-Luen Tu, Chia-Shiung Tsai, Xiaomeng Chen, Pin-Nan Tseng | 2019-10-22 |
| 10384933 | Method of forming micro electromechanical system sensor | Chun-Wen Cheng, Hung-Chia Tsai, Lan-Lin Chao, Yuan-Chih Hsieh | 2019-08-20 |
| 10351418 | Bond rings in semiconductor devices and methods of forming same | Chih-Ming Chen, Chung-Yi Yu, Yeur-Luen Tu | 2019-07-16 |
| 10354972 | Hybrid bonding systems and methods for semiconductor wafers | Shih-Wei Lin, Xin-Hua Huang, Lan-Lin Chao, Chia-Shiung Tsai | 2019-07-16 |
| 10294098 | Method for manufacturing a MEMS device by first hybrid bonding a CMOS wafer to a MEMS wafer | Hung-Hua Lin, Chang-Ming Wu, Chung-Yi Yu, Jung-Huei Peng | 2019-05-21 |
| 10283448 | Multiple metal layer semiconductor device and low temperature stacking method of fabricating the same | Kai-Wen Cheng, Xin-Hua Huang, Lan-Lin Chao, Chia-Shiung Tsai, Xiaomeng Chen | 2019-05-07 |
| 10280076 | Semiconductor structure and manufacturing method thereof | Hung-Hua Lin, Kuan-Liang Liu, Chia-Shiung Tsai, Alexander Kalnitsky | 2019-05-07 |
| 10160638 | Method and apparatus for a semiconductor structure | Li-Cheng Chu, Xin-Hua Huang, Yuan-Chih Hsieh, Lan-Lin Chao, Chun-Wen Cheng | 2018-12-25 |
| 10128209 | Wafer bonding process and structure | Lan-Lin Chao, Cheng-Tai Hsiao, Xin-Hua Huang, Hsun-Chung Kuang | 2018-11-13 |