Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12211727 | Simultaneous bonding approach for high quality wafer stacking | Xin-Hua Huang, Ping-Yin Liu | 2025-01-28 |
| 11670524 | Fully automated wafer debonding system and method thereof | Cheng-Fei Yu, Ting-Yau Shiu, Cheng-Kang Hu, Hsu-Shui Liu, Jiun-Rong Pai | 2023-06-06 |
| 11621186 | Simultaneous bonding approach for high quality wafer stacking applications | Xin-Hua Huang, Ping-Yin Liu | 2023-04-04 |
| 11094575 | Simultaneous bonding approach for high quality wafer stacking applications | Xin-Hua Huang, Ping-Yin Liu | 2021-08-17 |
| 10889097 | Wafer debonding system and method | Kuo-Liang Lu, Ru-Liang Lee, Sheng-Hsiang Chuang, Yu-Hung Cheng, Yeur-Luen Tu +1 more | 2021-01-12 |
| 10569520 | Wafer debonding system and method | Kuo-Liang Lu, Ru-Liang Lee, Sheng-Hsiang Chuang, Yu-Hung Cheng, Yeur-Luen Tu +1 more | 2020-02-25 |
| 10155369 | Wafer debonding system and method | Kuo-Liang Lu, Ru-Liang Lee, Sheng-Hsiang Chuang, Yu-Hung Cheng, Yeur-Luen Tu +1 more | 2018-12-18 |