Issued Patents All Time
Showing 76–100 of 125 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9576827 | Apparatus and method for wafer level bonding | Yen-Chang Chu, Xin-Hua Huang, Lan-Lin Chao, Yeur-Luen Tu, Ru-Liang Lee | 2017-02-21 |
| 9533876 | MEMS structures and methods for forming the same | Xin-Hua Huang, Hsin-Ting Huang, Yuan-Chih Hsieh, Jung-Huei Peng, Lan-Lin Chao +2 more | 2017-01-03 |
| 9527188 | Grinding wheel for wafer edge trimming | Xin-Hua Huang, Yuan-Chih Hsieh, Lan-Lin Chao, Chia-Shiung Tsai | 2016-12-27 |
| 9508586 | Debonding schemes | Xin-Hua Huang, Hung-Hua Lin, Lan-Lin Chao, Chia-Shiung Tsai | 2016-11-29 |
| 9502396 | Air trench in packages incorporating hybrid bonding | Bruce C. S. Chou, Chen-Jong Wang, Jung-Kuo Tu, Tsung-Te Chou, Xin-Hua Huang +4 more | 2016-11-22 |
| 9490158 | Bond chuck, methods of bonding, and tool including bond chuck | Chih-Hui Huang, Yen-Chang Chu, Kuan-Liang Liu, Cheng-Yuan Tsai, Yeur-Luen Tu +2 more | 2016-11-08 |
| 9478471 | Apparatus and method for verification of bonding alignment | Xin-Hua Huang, Lan-Lin Chao | 2016-10-25 |
| 9472504 | Semiconductor having a high aspect ratio via | Yuan-Chih Hsieh, Li-Cheng Chu, Ming-Tung Wu, Lan-Lin Chao, Chia-Shiung Tsai | 2016-10-18 |
| 9446467 | Integrate rinse module in hybrid bonding platform | Xin-Hua Huang, Hung-Hua Lin, Xin-Chung Kuang, Yuan-Chih Hsieh, Lan-Lin Chao +2 more | 2016-09-20 |
| 9443796 | Air trench in packages incorporating hybrid bonding | Bruce C. S. Chou, Chen-Jong Wang, Jung-Kuo Tu, Tsung-Te Chou, Xin-Hua Huang +4 more | 2016-09-13 |
| 9431256 | Semiconductor device and manufacturing method thereof | Cheng-Yuan Hsu, Zhen Chen, Chi Ren, Ching-Long Tsai, Wei-Chi Cheng | 2016-08-30 |
| 9425155 | Wafer bonding process and structure | Hsun-Chung Kuang, Cheng-Tai Hsiao, Xin-Hua Huang, Lan-Lin Chao | 2016-08-23 |
| 9412725 | Method and apparatus for image sensor packaging | Szu-Ying Chen, Calvin Yi-Ping Chao, Tzu-Jui Wang, Jen-Cheng Liu, Dun-Nian Yaung +1 more | 2016-08-09 |
| 9406711 | Apparatus and method for backside illuminated image sensors | Szu-Ying Chen, Tzu-Jui Wang, Jen-Cheng Liu, Dun-Nian Yaung, Lan-Lin Chao | 2016-08-02 |
| 9385010 | Multiple swivel arm design in hybrid bonder | Xin-Hua Huang, Lan-Lin Chao | 2016-07-05 |
| 9331032 | Hybrid bonding and apparatus for performing the same | Xin-Hua Huang, Chih-Hui Huang, Lan-Lin Chao, Yeur-Luen Tu, Yan-Chih Lu +2 more | 2016-05-03 |
| 9293445 | Wafer level packaging bond | Li-Chen CHU, Hung-Hua Lin, H. T. Huang, Jung-Huei Peng, Yuan-Chih Hsieh +3 more | 2016-03-22 |
| 9293303 | Low contamination chamber for surface activation | Xin-Hua Huang, Lee-Chuan Tseng, Lan-Lin Chao | 2016-03-22 |
| 9257399 | 3D integrated circuit and methods of forming the same | Hsun-Chung Kuang, Yen-Chang Chu, Cheng-Tai Hsiao, Lan-Lin Chao, Yeur-Luen Tu +2 more | 2016-02-09 |
| 9142517 | Hybrid bonding mechanisms for semiconductor wafers | Szu-Ying Chen, Chen-Jong Wang, Chih-Hui Huang, Xin-Hua Huang, Lan-Lin Chao +3 more | 2015-09-22 |
| 9136302 | Apparatus for vertically integrated backside illuminated image sensors | Tzu-Jui Wang, Szu-Ying Chen, Jen-Cheng Liu, Dun-Nian Yaung, Lan-Lin Chao | 2015-09-15 |
| 9099476 | Semiconductor having a high aspect ratio via | Yuan-Chih Hsieh, Li-Cheng Chu, Ming-Tung Wu, Lan-Lin Chao, Chia-Shiung Tsai | 2015-08-04 |
| 9054121 | MEMS structures and methods for forming the same | Xin-Hua Huang, Hsin-Ting Huang, Yuan-Chih Hsieh, Jung-Huei Peng, Lan-Lin Chao +2 more | 2015-06-09 |
| 9048283 | Hybrid bonding systems and methods for semiconductor wafers | Shih-Wei Lin, Xin-Hua Huang, Lan-Lin Chao, Chia-Shiung Tsai | 2015-06-02 |
| 9034677 | MEMS device and method of formation thereof | Hsin-Ting Huang, Jung-Huei Peng, Shang-Ying Tsai, Yao-Te Huang, Ming-Tung Wu +2 more | 2015-05-19 |