Issued Patents All Time
Showing 51–75 of 125 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10103122 | Hybrid bonding systems and methods for semiconductor wafers | Shih-Wei Lin, Xin-Hua Huang, Lan-Lin Chao, Chia-Shiung Tsai | 2018-10-16 |
| 10096645 | Method and apparatus for image sensor packaging | Szu-Ying Chen, Calvin Yi-Ping Chao, Tzu-Jui Wang, Jen-Cheng Liu, Dun-Nian Yaung +1 more | 2018-10-09 |
| 10090196 | 3D integrated circuit and methods of forming the same | Hsun-Chung Kuang, Yen-Chang Chu, Cheng-Tai Hsiao, Lan-Lin Chao, Yeur-Luen Tu +2 more | 2018-10-02 |
| 10049901 | Apparatus and method for wafer level bonding | Yen-Chang Chu, Xin-Hua Huang, Lan-Lin Chao, Yeur-Luen Tu, Ru-Liang Lee | 2018-08-14 |
| 10037968 | Alignment systems and wafer bonding systems and methods | Xin-Hua Huang, Xiaomeng Chen, Lan-Lin Chao | 2018-07-31 |
| 10012899 | Graphene pellicle for extreme ultraviolet lithography | Chih-Chiang Tu, Chun-Lang Chen, Chue-San Yoo, Jong-Yuh Chang, Chia-Shiung Tsai +3 more | 2018-07-03 |
| 9960129 | Hybrid bonding mechanisms for semiconductor wafers | Szu-Ying Chen, Chen-Jong Wang, Chih-Hui Huang, Xin-Hua Huang, Lan-Lin Chao +3 more | 2018-05-01 |
| 9957156 | Bond rings in semiconductor devices and methods of forming same | Chih-Ming Chen, Chung-Yi Yu, Yeur-Luen Tu | 2018-05-01 |
| 9953847 | Apparatus and method for cleaning | Xin-Hua Huang, Lan-Lin Chao | 2018-04-24 |
| 9917069 | Hybrid bonding system and cleaning method thereof | Yeong-Jyh Lin, Xin-Hua Huang, Chia-Shiung Tsai | 2018-03-13 |
| 9887155 | Multiple metal layer semiconductor device and low temperature stacking method of fabricating the same | Kai-Wen Cheng, Xin-Hua Huang, Lan-Lin Chao, Chia-Shiung Tsai, Xiaomeng Chen | 2018-02-06 |
| 9842785 | Apparatus and method for verification of bonding alignment | Xin-Hua Huang, Lan-Lin Chao | 2017-12-12 |
| 9834435 | Structure and formation method of semiconductor device structure | Xin-Hua Huang, Yeong-Jyh Lin, Jung-Huei Peng | 2017-12-05 |
| 9786628 | Air trench in packages incorporating hybrid bonding | Bruce C. S. Chou, Chen-Jong Wang, Jung-Kuo Tu, Tsung-Te Chou, Xin-Hua Huang +4 more | 2017-10-10 |
| 9754813 | Bond chuck, methods of bonding, and tool including bond chuck | Chih-Hui Huang, Yen-Chang Chu, Kuan-Liang Liu, Cheng-Yuan Tsai, Yeur-Luen Tu +2 more | 2017-09-05 |
| 9748198 | Hybrid bonding systems and methods for semiconductor wafers | Shih-Wei Lin, Xin-Hua Huang, Lan-Lin Chao, Chia-Shiung Tsai | 2017-08-29 |
| 9741681 | Debonding schemes | Xin-Hua Huang, Hung-Hua Lin, Lan-Lin Chao, Chia-Shiung Tsai | 2017-08-22 |
| 9735033 | Multiple swivel arm design in hybrid bonder | Xin-Hua Huang, Lan-Lin Chao | 2017-08-15 |
| 9725310 | Micro electromechanical system sensor and method of forming the same | Chun-Wen Cheng, Hung-Chia Tsai, Lan-Lin Chao, Yuan-Chih Hsieh | 2017-08-08 |
| 9728453 | Methods for hybrid wafer bonding integrated with CMOS processing | Pin-Nan Tseng, Chia-Shiung Tsai | 2017-08-08 |
| 9711555 | Dual facing BSI image sensors with wafer level stacking | Yeur-Luen Tu, Chia-Shiung Tsai, Xiaomeng Chen, Pin-Nan Tseng | 2017-07-18 |
| 9704820 | Semiconductor manufacturing method and associated semiconductor manufacturing system | Xin-Hua Huang, Yung-Lung Lin, Chia-Shiung Tsai | 2017-07-11 |
| 9646860 | Alignment systems and wafer bonding systems and methods | Xin-Hua Huang, Xiaomeng Chen, Lan-Lin Chao | 2017-05-09 |
| 9627243 | Method and apparatus of holding a device | Chung-Yi Yu, Che Ying Hsu, Yeur-Luen Tu, Da-Hsiang Chou, Chia-Shiung Tsai | 2017-04-18 |
| 9611141 | Self-removal anti-stiction coating for bonding process | Li-Cheng Chu, Hung-Hua Lin, Shang-Ying Tsai, Yuan-Chih Hsieh, Jung-Huei Peng +3 more | 2017-04-04 |