Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10699977 | Method of detecting delamination in an integrated circuit package structure | Yang-Che Chen, Chen-Hua Lin, Huang-Wen Tseng, Chwen-Ming Liu | 2020-06-30 |
| 10347548 | Integrated circuit package structure and testing method using the same | Yang-Che Chen, Chen-Hua Lin, Huang-Wen Tseng, Chwen-Ming Liu | 2019-07-09 |
| 9786628 | Air trench in packages incorporating hybrid bonding | Bruce C. S. Chou, Chen-Jong Wang, Ping-Yin Liu, Jung-Kuo Tu, Xin-Hua Huang +4 more | 2017-10-10 |
| 9502396 | Air trench in packages incorporating hybrid bonding | Bruce C. S. Chou, Chen-Jong Wang, Ping-Yin Liu, Jung-Kuo Tu, Xin-Hua Huang +4 more | 2016-11-22 |
| 9443796 | Air trench in packages incorporating hybrid bonding | Bruce C. S. Chou, Chen-Jong Wang, Ping-Yin Liu, Jung-Kuo Tu, Xin-Hua Huang +4 more | 2016-09-13 |