Issued Patents All Time
Showing 1–25 of 33 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12243788 | Method of testing semiconductor package | Chi-Hui Lai, Yang-Che Chen, Chen-Hua Lin, Victor Chiang Liang | 2025-03-04 |
| 12183655 | Semiconductor device with enhanced thermal dissipation and method for making the same | Yang-Che Chen, Chen-Hua Lin, Huang-Wen Tseng, Victor Chiang Liang | 2024-12-31 |
| 12027433 | Semiconductor package and method for making the same | Yang-Che Chen, Chen-Hua Lin, Huang-Wen Tseng, Victor Chiang Liang | 2024-07-02 |
| 11993512 | Dual micro-electro mechanical system and manufacturing method thereof | Yang-Che Chen, Victor Chiang Liang, Chen-Hua Lin, Huang-Wen Tseng, Yi-Chuan Teng | 2024-05-28 |
| 11908884 | Inductive device | Wei-Yu Chou, Yang-Che Chen, Chen-Hua Lin, Victor Chiang Liang, Huang-Wen Tseng | 2024-02-20 |
| 11854913 | Method for detecting defects in semiconductor device | Yang-Che Chen, Wei-Yu Chou, Hong-Seng Shue, Chen-Hua Lin, Huang-Wen Tseng +1 more | 2023-12-26 |
| 11837526 | Semiconductor package structure and method for manufacturing the same | Yang-Che Chen, Chen-Hua Lin, Huang-Wen Tseng, Victor Chiang Liang | 2023-12-05 |
| 11804433 | Semiconductor package structure and method for forming the same | Yang-Che Chen, Chen-Hua Lin, Victor Chiang Liang, Huang-Wen Tseng | 2023-10-31 |
| 11776919 | Semiconductor package | Yang-Che Chen, Victor Chiang Liang, Chen-Hua Lin, Huang-Wen Tseng | 2023-10-03 |
| 11769698 | Method of testing semiconductor package | Chi-Hui Lai, Yang-Che Chen, Chen-Hua Lin, Victor Chiang Liang | 2023-09-26 |
| 11721597 | Semiconductor device and manufacturing method of the same | Yang-Che Chen, Chen-Hua Lin, Victor Chiang Liang, Huang-Wen Tseng | 2023-08-08 |
| 11626343 | Semiconductor device with enhanced thermal dissipation and method for making the same | Yang-Che Chen, Chen-Hua Lin, Huang-Wen Tseng, Victor Chiang Liang | 2023-04-11 |
| 11482461 | Semiconductor package and method for making the same | Yang-Che Chen, Chen-Hua Lin, Huang-Wen Tseng, Victor Chiang Liang | 2022-10-25 |
| 11450626 | Semiconductor package | Yang-Che Chen, Victor Chiang Liang, Chen-Hua Lin, Huang-Wen Tseng | 2022-09-20 |
| 11322576 | Inductive device | Wei-Yu Chou, Yang-Che Chen, Chen-Hua Lin, Victor Chiang Liang, Huang-Wen Tseng | 2022-05-03 |
| 11274037 | Dual micro-electro mechanical system and manufacturing method thereof | Yang-Che Chen, Victor Chiang Liang, Chen-Hua Lin, Huang-Wen Tseng, Yi-Chuan Teng | 2022-03-15 |
| 11088037 | Semiconductor device having probe pads and seal ring | Yang-Che Chen, Wei-Yu Chou, Hong-Seng Shue, Chen-Hua Lin, Huang-Wen Tseng +1 more | 2021-08-10 |
| 10937858 | Method for manufacturing semiconductor and structure thereof | Yang-Che Chen, Chen-Hua Lin, Huang-Wen Tseng, Victor Chiang Liang | 2021-03-02 |
| 10937772 | Semiconductor package and method for manufacturing the same | Yang-Che Chen, Chen-Hua Lin, Huang-Wen Tseng, Victor Chiang Liang | 2021-03-02 |
| 10699977 | Method of detecting delamination in an integrated circuit package structure | Yang-Che Chen, Tsung-Te Chou, Chen-Hua Lin, Huang-Wen Tseng | 2020-06-30 |
| 10629673 | Method for manufacturing semiconductor and structure thereof | Yang-Che Chen, Chen-Hua Lin, Huang-Wen Tseng, Victor Chiang Liang | 2020-04-21 |
| 10347548 | Integrated circuit package structure and testing method using the same | Yang-Che Chen, Tsung-Te Chou, Chen-Hua Lin, Huang-Wen Tseng | 2019-07-09 |
| 6314379 | Integrated defect yield management and query system | Ding Hu, Chih-Ming Huang, Li-Chun Chen | 2001-11-06 |
| 6248624 | Method for forming a dram stacked capacitor of zig-zag configuration | — | 2001-06-19 |
| 6005277 | ARC layer enhancement for reducing metal loss during via etch | Jiann-Jong Wang, Chung-Chieh Liu | 1999-12-21 |