Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8642390 | Tape residue-free bump area after wafer back grinding | Chung Yu Wang | 2014-02-04 |
| 7750470 | Methods for planarization of dielectric layer around metal patterns for optical efficiency enhancement | Yeou-Lang Hsieh, Chin-Min Lin | 2010-07-06 |
| 7732337 | Method for manufacturing the shallow trench isolation structure | Chi-Long Chung | 2010-06-08 |
| 7196012 | Methods for planarization of dielectric layer around metal patterns for optical efficiency enhancement | Yeou-Lang Hsieh, Chin-Min Lin | 2007-03-27 |
| 7105416 | Method for controlling the top width of a trench | Ping Hsu | 2006-09-12 |
| 6875669 | Method of controlling the top width of a deep trench | Ping Hsu | 2005-04-05 |
| 6187655 | Method for performing a pre-amorphization implant (PAI) which provides reduced resist protect oxide damage and reduced junction leakage | Ding Hu, Horng-Jer Hsiue, Ching-Kunn Huang | 2001-02-13 |
| 6162354 | Integrated check valve/strainer-filter assembly | Biing-Huang Yang, Ming Ni, Shao Wei Ku, Wei-Cheng Lee, Ta Jung Feng +1 more | 2000-12-19 |
| 6005277 | ARC layer enhancement for reducing metal loss during via etch | Chwen-Ming Liu, Chung-Chieh Liu | 1999-12-21 |