CH

Ching-Kunn Huang

TSMC: 1 patents #8,466 of 12,232Top 70%
📍 Baoshan, TW: #2,187 of 3,661 inventorsTop 60%
Overall (All Time): #3,572,254 of 4,157,543Top 90%
1
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Issued Patents All Time

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6187655 Method for performing a pre-amorphization implant (PAI) which provides reduced resist protect oxide damage and reduced junction leakage Jiann-Jong Wang, Ding Hu, Horng-Jer Hsiue 2001-02-13