Issued Patents All Time
Showing 1–25 of 36 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10269731 | Apparatus for dicing interposer assembly | Kung-Chen Yeh, Chih-Wei Wu, Szu-Wei Lu, Jing-Cheng Lin | 2019-04-23 |
| 9362474 | Vertical LED chip package on TSV carrier | — | 2016-06-07 |
| 9343505 | Wafer level reflector for LED packaging | Hao-Wei Ku, Yu-Sheng Tang, Hsin-Hung Chen, Hao-Yu Yang, Ching-Yi Chen +5 more | 2016-05-17 |
| 9337096 | Apparatus and methods for molding die on wafer interposers | Chih-Wei Wu, Szu-Wei Lu, Jing-Cheng Lin | 2016-05-10 |
| 9337063 | Package for three dimensional integrated circuit | Chih-Hao Chen, Long Hua Lee, Chun-Hsing Su, Yi-Lin Tsai, Kung-Chen Yeh +2 more | 2016-05-10 |
| 9136211 | Protected solder ball joints in wafer level chip-scale packaging | Chien-Hsun Lee, Pei-Haw Tsao, Kuo-Chin Chang, Chung-Yi Lin, Bill Kiang | 2015-09-15 |
| 8946893 | Apparatus for dicing interposer assembly | Kung-Chen Yeh, Chih-Wei Wu, Szu-Wei Lu, Jing-Cheng Lin | 2015-02-03 |
| 8900893 | Vertical LED chip package on TSV carrier | — | 2014-12-02 |
| 8816495 | Structures and formation methods of packages with heat sinks | Shih-Yi Syu, Jing-Cheng Lin | 2014-08-26 |
| 8772929 | Package for three dimensional integrated circuit | Chih-Hao Chen, Long Hua Lee, Chun-Hsing Su, Yi-Lin Tsai, Kung-Chen Yeh +2 more | 2014-07-08 |
| 8642390 | Tape residue-free bump area after wafer back grinding | Jiann-Jong Wang | 2014-02-04 |
| 8628984 | Light-emitting diode (LED) package systems | — | 2014-01-14 |
| 8629043 | Methods for de-bonding carriers | Jui-Pin Hung, Chih-Hao Chen, Chun-Hsing Su, Yi-Chao Mao, Kung-Chen Yeh +7 more | 2014-01-14 |
| 8580683 | Apparatus and methods for molding die on wafer interposers | Chih-Wei Wu, Szu-Wei Lu, Jing-Cheng Lin | 2013-11-12 |
| 8501590 | Apparatus and methods for dicing interposer assembly | Kung-Chen Yeh, Chih-Wei Wu, Szu-Wei Lu, Jing-Cheng Lin | 2013-08-06 |
| 8492263 | Protected solder ball joints in wafer level chip-scale packaging | Chien-Hsiun Lee, Pei-Haw Tsao, Kuo-Chin Chang, Chung-Yi Lin, Bill Kiang | 2013-07-23 |
| 8486724 | Wafer level reflector for LED packaging | Hao-Wei Ku, Yu-Sheng Tang, Hsin-Hung Chen, Hao-Yu Yang, Ching-Yi Chen +5 more | 2013-07-16 |
| 8408734 | Structure of lighting device | Chih-Hsien Wu, MENG-CHIEH CHOU | 2013-04-02 |
| 8399269 | LED flip-chip package structure with dummy bumps | — | 2013-03-19 |
| 8390009 | Light-emitting diode (LED) package systems | — | 2013-03-05 |
| 8183578 | Double flip-chip LED package components | — | 2012-05-22 |
| 8183579 | LED flip-chip package structure with dummy bumps | — | 2012-05-22 |
| 8183580 | Thermally-enhanced hybrid LED package components | — | 2012-05-22 |
| 8046106 | Controlling method and system for saving energy of building | Kun-Cheng Tsai, Jing-Tian Sung | 2011-10-25 |
| 7833896 | Aluminum cap for reducing scratch and wire-bond bridging of bond pads | Chien-Hsiun Lee | 2010-11-16 |