Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12148661 | Method of forming integrated fan-out packages with built-in heat sink | Chih-Wei Wu, Ying-Ching Shih, Szu-Wei Lu, Jing-Cheng Lin | 2024-11-19 |
| 12080617 | Underfill structure for semiconductor packages and methods of forming the same | Yu-Wei Chen, Li-Chung Kuo, Ying-Ching Shih, Szu-Wei Lu, Jing-Cheng Lin +1 more | 2024-09-03 |
| 11842936 | Underfill structure for semiconductor packages and methods of forming the same | Yu-Wei Chen, Li-Chung Kuo, Ying-Ching Shih, Szu-Wei Lu, Jing-Cheng Lin +1 more | 2023-12-12 |
| 11621205 | Underfill structure for semiconductor packages and methods of forming the same | Yu-Wei Chen, Li-Chung Kuo, Ying-Ching Shih, Szu-Wei Lu, Jing-Cheng Lin +1 more | 2023-04-04 |
| 11257715 | Integrated fan-out packages and methods of forming the same | Chih-Wei Wu, Ying-Ching Shih, Szu-Wei Lu, Jing-Cheng Lin | 2022-02-22 |
| 11201097 | Method of manufacture of a semiconductor device | Kuan-Yu Huang, Chih-Wei Wu, Li-Chung Kuo, Sung-Hui Huang, Ying-Ching Shih +1 more | 2021-12-14 |
| 11121050 | Method of manufacture of a semiconductor device | Kuan-Yu Huang, Chih-Wei Wu, Li-Chung Kuo, Sung-Hui Huang, Ying-Ching Shih +1 more | 2021-09-14 |
| 11075133 | Underfill structure for semiconductor packages and methods of forming the same | Yu-Wei Chen, Li-Chung Kuo, Ying-Ching Shih, Szu-Wei Lu, Jing-Cheng Lin +1 more | 2021-07-27 |
| 11024616 | Package structure and method of manufacturing the same | Yu-Wei Chen, Li-Chung Kuo, Szu-Wei Lu, Ying-Ching Shih, Kuan-Yu Huang | 2021-06-01 |
| 10510595 | Integrated fan-out packages and methods of forming the same | Chih-Wei Wu, Ying-Ching Shih, Szu-Wei Lu, Jing-Cheng Lin | 2019-12-17 |
| 10157879 | Die-to-die gap control for semiconductor structure and method | Jing-Cheng Lin, Szu-Wei Lu, Ying-Ching Shih, Ying-Da Wang, Li-Chung Kuo +2 more | 2018-12-18 |
| 9337063 | Package for three dimensional integrated circuit | Chih-Hao Chen, Chun-Hsing Su, Yi-Lin Tsai, Kung-Chen Yeh, Chung Yu Wang +2 more | 2016-05-10 |
| 8963334 | Die-to-die gap control for semiconductor structure and method | Jing-Cheng Lin, Szu-Wei Lu, Ying-Ching Shih, Ying-Da Wang, Li-Chung Kuo +2 more | 2015-02-24 |
| 8941244 | Semiconductor device and manufacturing method thereof | Po-Hao Tsai, Jui-Pin Hung, Jing-Cheng Lin | 2015-01-27 |
| 8772929 | Package for three dimensional integrated circuit | Chih-Hao Chen, Chun-Hsing Su, Yi-Lin Tsai, Kung-Chen Yeh, Chung Yu Wang +2 more | 2014-07-08 |
| 8629043 | Methods for de-bonding carriers | Chung Yu Wang, Jui-Pin Hung, Chih-Hao Chen, Chun-Hsing Su, Yi-Chao Mao +7 more | 2014-01-14 |
| 6852358 | Process for preparing an optical waveguide component from acrylate/titanium alkoxide composite material and the prepared optical waveguide component | Wen-Chang Chen | 2005-02-08 |