Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12255155 | Package structure with stacked semiconductor dies | Chin-Chuan Chang, Szu-Wei Lu | 2025-03-18 |
| 12131965 | Apparatus for detecting end point | Chin-Chuan Chang, Szu-Wei Lu | 2024-10-29 |
| 11996375 | Integrated circuit structure, and method for forming thereof | Chin-Chuan Chang, Szu-Wei Lu, Kun-Tong Tsai, Hung Chih Chen | 2024-05-28 |
| 11862523 | Apparatus for detecting end point | Chin-Chuan Chang, Szu-Wei Lu | 2024-01-02 |
| 11728190 | System for thinning substrate | Chin-Chuan Chang, Szu-Wei Lu | 2023-08-15 |
| 11616034 | Integrated circuit structure, and method for forming thereof | Chin-Chuan Chang, Szu-Wei Lu, Kun-Tong Tsai, Hung Chih Chen | 2023-03-28 |
| 11239180 | Structure and formation method of package structure with stacked semiconductor dies | Chin-Chuan Chang, Szu-Wei Lu | 2022-02-01 |
| 11069653 | Methods and structures for packaging semiconductor dies | Jing-Cheng Lin | 2021-07-20 |
| 11056364 | Method for substrate thinning | Chin-Chuan Chang, Szu-Wei Lu | 2021-07-06 |
| 10964609 | Apparatus and method for detecting end point | Chin-Chuan Chang, Szu-Wei Lu | 2021-03-30 |
| 10672631 | Method and system for substrate thinning | Chin-Chuan Chang, Szu-Wei Lu | 2020-06-02 |
| 10518387 | Grinding element, grinding wheel and manufacturing method of semiconductor package using the same | Chin-Chuan Chang, Jing-Cheng Lin, Wen-Hua Chang | 2019-12-31 |
| 9960088 | End point detection in grinding | Jui-Pin Hung, Jing-Cheng Lin, Shin-Puu Jeng, Chen-Hua Yu | 2018-05-01 |
| 9847269 | Fan-out packages and methods of forming same | Jing-Cheng Lin, Jeffrey Chang, Chun-Hsing Su, Tsei-Chung Fu | 2017-12-19 |
| 9698121 | Methods and structures for packaging semiconductor dies | Jing-Cheng Lin | 2017-07-04 |
| 9406598 | Package with a fan-out structure and method of forming the same | Chin-Chuan Chang, Jui-Pin Hung, Jing-Cheng Lin | 2016-08-02 |
| 9358660 | Grinding wheel design with elongated teeth arrangement | Chun-Hsing Su, Jing-Cheng Lin, Tsei-Chung Fu, Wen-Hua Chang | 2016-06-07 |
| 9312148 | Method of packaging a semiconductor device | Jing-Cheng Lin, Jui-Pin Hung, Nai-Wei Liu, Wan-Ting Shih, Tsan-Hua Tung | 2016-04-12 |
| 9064879 | Packaging methods and structures using a die attach film | Jui-Pin Hung, Jing-Cheng Lin, Nai-Wei Liu, Chin-Chuan Chang, Chen-Hua Yu +3 more | 2015-06-23 |
| 9000584 | Packaged semiconductor device with a molding compound and a method of forming the same | Jing-Cheng Lin, Jui-Pin Hung, Nai-Wei Liu, Wan-Ting Shih, Tsan-Hua Tung | 2015-04-07 |
| 8785299 | Package with a fan-out structure and method of forming the same | Chin-Chuan Chang, Jui-Pin Hung, Jing-Cheng Lin | 2014-07-22 |
| 8629043 | Methods for de-bonding carriers | Chung Yu Wang, Jui-Pin Hung, Chih-Hao Chen, Chun-Hsing Su, Kung-Chen Yeh +7 more | 2014-01-14 |